EP4CE75F29C9L

IC FPGA 426 I/O 780FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 426 2810880 75408 780-BGA

Quantity 621 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BGANumber of I/O426Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4713Number of Logic Elements/Cells75408
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2810880

Overview of EP4CE75F29C9L – Cyclone IV E FPGA, 75,408 logic elements, 780‑FBGA (29×29)

The EP4CE75F29C9L is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel, offering a high logic element count and extensive I/O in a compact BGA package. It combines programmable logic, on-chip RAM and a large I/O footprint for developers building complex digital systems.

With 75,408 logic elements, approximately 2.81 Mbits of embedded memory and 426 user I/Os, this device targets commercial embedded designs, system integration and I/O‑rich applications that require a balance of integration, density and low‑voltage operation.

Key Features

  • Core Logic 75,408 logic elements provide substantial programmable fabric for implementing complex digital functions and custom logic blocks.
  • Embedded Memory Approximately 2.81 Mbits of on‑chip RAM for buffering, FIFOs and local data storage to reduce external memory requirements.
  • I/O Resources 426 user I/Os support wide connectivity and interface consolidation on a single device.
  • Package & Mounting 780‑FBGA (29×29) package in a surface‑mount configuration for compact board layouts and high pin density.
  • Low‑Voltage Core Core supply voltage range of 0.970 V to 1.03 V to support low‑voltage system designs.
  • Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial environments.
  • Regulatory Compliance RoHS compliant to meet lead‑free manufacturing requirements.
  • Comprehensive Documentation Device handbook and datasheet content include operating conditions, absolute maximum ratings, recommended operating conditions, DC characteristics, supply current and power consumption, switching characteristics, transceiver and core performance specifications.

Typical Applications

  • Embedded Systems & Prototyping — Implement custom processing, glue logic and rapid prototyping where substantial programmable logic and on‑chip RAM are required.
  • Communications & Networking — Use the device’s logic density and large I/O count for protocol bridging, packet handling and interface aggregation.
  • Instrumentation & Test Equipment — Leverage abundant I/O and embedded memory for data acquisition, buffering and real‑time control tasks in commercial test systems.
  • Interface Hubs & Aggregation — Consolidate multiple peripherals and bus interfaces into a single programmable device to reduce external components.

Unique Advantages

  • High logic density: 75,408 logic elements enable substantial on‑chip implementation of complex logic without immediate need for multiple devices.
  • Generous on‑chip memory: Approximately 2.81 Mbits of embedded RAM simplifies data buffering and local storage, reducing dependence on external memories.
  • Large I/O capacity: 426 user I/Os allow direct connection to numerous peripherals and buses, lowering BOM and board complexity.
  • Compact BGA footprint: 780‑FBGA (29×29) package delivers high pin count in a space‑efficient form factor for dense PCB designs.
  • Low‑voltage operation: 0.970–1.03 V core supply supports designs targeting reduced power budgets and modern low‑voltage logic domains.
  • Ready technical reference: Supported by the Cyclone IV device handbook and datasheet content that detail electrical, timing and performance specifications for design validation.

Why Choose EP4CE75F29C9L?

The EP4CE75F29C9L positions itself as a commercially graded, highly integrated FPGA option for designers who need substantial logic resources, on‑chip memory and a large I/O complement in a compact BGA package. Its low‑voltage core and documented device specifications make it suitable for commercial embedded systems, prototyping and interface‑heavy applications.

Choosing this device gives access to extensive device documentation covering operating conditions, DC and switching characteristics, power consumption and performance specifications to support design validation and system integration efforts.

Request a quote or submit a pricing and availability inquiry to evaluate EP4CE75F29C9L for your next design project.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up