EP4CE75F29C9L
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 426 2810880 75408 780-BGA |
|---|---|
| Quantity | 621 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 426 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4713 | Number of Logic Elements/Cells | 75408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2810880 |
Overview of EP4CE75F29C9L – Cyclone IV E FPGA, 75,408 logic elements, 780‑FBGA (29×29)
The EP4CE75F29C9L is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel, offering a high logic element count and extensive I/O in a compact BGA package. It combines programmable logic, on-chip RAM and a large I/O footprint for developers building complex digital systems.
With 75,408 logic elements, approximately 2.81 Mbits of embedded memory and 426 user I/Os, this device targets commercial embedded designs, system integration and I/O‑rich applications that require a balance of integration, density and low‑voltage operation.
Key Features
- Core Logic 75,408 logic elements provide substantial programmable fabric for implementing complex digital functions and custom logic blocks.
- Embedded Memory Approximately 2.81 Mbits of on‑chip RAM for buffering, FIFOs and local data storage to reduce external memory requirements.
- I/O Resources 426 user I/Os support wide connectivity and interface consolidation on a single device.
- Package & Mounting 780‑FBGA (29×29) package in a surface‑mount configuration for compact board layouts and high pin density.
- Low‑Voltage Core Core supply voltage range of 0.970 V to 1.03 V to support low‑voltage system designs.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial environments.
- Regulatory Compliance RoHS compliant to meet lead‑free manufacturing requirements.
- Comprehensive Documentation Device handbook and datasheet content include operating conditions, absolute maximum ratings, recommended operating conditions, DC characteristics, supply current and power consumption, switching characteristics, transceiver and core performance specifications.
Typical Applications
- Embedded Systems & Prototyping — Implement custom processing, glue logic and rapid prototyping where substantial programmable logic and on‑chip RAM are required.
- Communications & Networking — Use the device’s logic density and large I/O count for protocol bridging, packet handling and interface aggregation.
- Instrumentation & Test Equipment — Leverage abundant I/O and embedded memory for data acquisition, buffering and real‑time control tasks in commercial test systems.
- Interface Hubs & Aggregation — Consolidate multiple peripherals and bus interfaces into a single programmable device to reduce external components.
Unique Advantages
- High logic density: 75,408 logic elements enable substantial on‑chip implementation of complex logic without immediate need for multiple devices.
- Generous on‑chip memory: Approximately 2.81 Mbits of embedded RAM simplifies data buffering and local storage, reducing dependence on external memories.
- Large I/O capacity: 426 user I/Os allow direct connection to numerous peripherals and buses, lowering BOM and board complexity.
- Compact BGA footprint: 780‑FBGA (29×29) package delivers high pin count in a space‑efficient form factor for dense PCB designs.
- Low‑voltage operation: 0.970–1.03 V core supply supports designs targeting reduced power budgets and modern low‑voltage logic domains.
- Ready technical reference: Supported by the Cyclone IV device handbook and datasheet content that detail electrical, timing and performance specifications for design validation.
Why Choose EP4CE75F29C9L?
The EP4CE75F29C9L positions itself as a commercially graded, highly integrated FPGA option for designers who need substantial logic resources, on‑chip memory and a large I/O complement in a compact BGA package. Its low‑voltage core and documented device specifications make it suitable for commercial embedded systems, prototyping and interface‑heavy applications.
Choosing this device gives access to extensive device documentation covering operating conditions, DC and switching characteristics, power consumption and performance specifications to support design validation and system integration efforts.
Request a quote or submit a pricing and availability inquiry to evaluate EP4CE75F29C9L for your next design project.

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