EP4CE75F29C8LN

The EP4CE75F29C8LN is a commercial-grade Cyclone® IV E field programmable gate array (FPGA) from Intel. It provides a high-density programmable logic fabric with 75,408 logic elements and approximately 2.81 Mbits of embedded memory for implementing complex digital functions.

Designed for surface-mount assembly in a 780-ball FBGA (29×29) package, this device delivers extensive I/O (426 pins) and supports a core voltage range of 0.970 V to 1.03 V while operating across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic — 75,408 logic elements to implement wide-ranging programmable logic and custom digital processing functions.
• Embedded Memory — Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs, and memory-mapped logic structures.
• I/O Capacity — 426 available I/O pins enabling high-density peripheral interfacing and board-level connectivity.
• Package and Mounting — 780-ball FBGA (29×29) package in a surface-mount form factor for compact, high-density PCB designs.
• Power Supply — Core voltage specification from 0.970 V to 1.03 V to align with system power rails and design margins.
• Operating Temperature and Grade — Commercial grade with an operating range of 0 °C to 85 °C suitable for standard commercial applications.
• Standards Compliance — RoHS compliant for environmentally conscious assembly and manufacturing.
• Documentation — Detailed device handbook and datasheet provide comprehensive operating conditions, DC characteristics, and timing information for system integration.

Typical Applications

• Prototyping and Development — Leverage the large logic element count and embedded memory to evaluate and prototype complex digital systems.
• High-density I/O Control — Use the 426 I/O pins to manage multiple peripherals, sensors, and interfaces on a single FPGA device.
• Embedded System Integration — Implement custom accelerators, glue-logic, and system orchestration functions within a compact FBGA package.

Unique Advantages

• High Logic Density: 75,408 logic elements allow consolidation of multiple functions into a single programmable device, reducing board-level complexity.
• Substantial On-chip Memory: Approximately 2.81 Mbits of embedded RAM supports local buffering and deterministic data paths without external memory.
• Extensive I/O Count: 426 I/O pins accommodate rich connectivity options for sensors, transceivers, and external controllers.
• Compact, Manufacturable Package: 780-ball FBGA (29×29) surface-mount package enables high-density PCB layouts and automated assembly processes.
• Commercial Temperature Range: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose EP4CE75F29C8LN?

The EP4CE75F29C8LN balances significant programmable logic capacity, on-chip memory, and a large complement of I/O in a compact surface-mount FBGA package. Its electrical and thermal specifications—documented in the Cyclone IV device handbook and product datasheet—make it a practical choice for designers consolidating multiple digital functions into a single FPGA on commercial-grade products.

This device is well suited to teams and projects that require a scalable, supported FPGA solution with clear documentation for electrical characteristics, timing, and power consumption, enabling predictable integration into complex boards and systems.

Request a quote or submit an inquiry to discuss pricing, availability, and lead times for EP4CE75F29C8LN. Our team can provide the documentation and support needed to evaluate this Cyclone IV E FPGA for your design.