EP4CE75F29C9LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 426 2810880 75408 780-BGA |
|---|---|
| Quantity | 978 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 426 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4713 | Number of Logic Elements/Cells | 75408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2810880 |
Overview of EP4CE75F29C9LN – Cyclone IV E FPGA, 780‑BGA, 75,408 logic elements
The EP4CE75F29C9LN is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel in a 780‑ball BGA package. It delivers a high logic element count and substantial on‑chip RAM in a commercial‑grade, surface‑mount FPGA.
Built for designs that require large programmable logic capacity and broad I/O integration, this device combines 75,408 logic elements, approximately 2.81 Mbits of embedded memory, and up to 426 I/O in a compact 780‑FBGA (29×29) footprint. The device operates from a low‑voltage core supply and supports commercial temperature ranges.
Key Features
- Logic Capacity — 75,408 logic elements to implement complex combinational and sequential logic designs without external programmable logic.
- Embedded Memory — Approximately 2.81 Mbits of on‑chip RAM for FIFOs, buffers, and small data stores located close to logic to reduce latency.
- I/O Density — Up to 426 I/O pins to accommodate multiple interface channels and board-level connectivity requirements.
- Power and Core Voltage — Core voltage supply range of 0.970 V to 1.03 V to support low‑voltage power domains.
- Package & Mounting — 780‑FBGA (29×29) package in a surface‑mount form factor for high I/O count in a compact board area.
- Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Standards & Compliance — RoHS compliant for reduced hazardous substance content.
Unique Advantages
- High integration density: Combines 75,408 logic elements and approximately 2.81 Mbits of embedded RAM to reduce the need for external logic and memory components.
- Large I/O capacity: 426 I/O pins provide flexibility to handle multiple parallel interfaces or mixed‑signal board partitions without external expanders.
- Compact BGA footprint: 780‑FBGA (29×29) offers a space‑efficient mounting solution for designs with tight PCB area constraints while preserving high pin count.
- Low‑voltage core support: 0.97–1.03 V core supply range supports designs targeting reduced power consumption in the core logic domain.
- Commercial suitability: Rated for 0 °C to 85 °C operation for mainstream embedded and industrial control applications that do not require extended temperature qualification.
Why Choose EP4CE75F29C9LN?
The EP4CE75F29C9LN positions itself as a high‑capacity, commercial‑grade Cyclone IV E FPGA suitable for projects that need substantial programmable logic, embedded memory, and broad I/O in a single, surface‑mount package. Its combination of 75,408 logic elements, approximately 2.81 Mbits of on‑chip RAM, and 426 I/O pins supports scalable designs that consolidate functions and reduce bill‑of‑materials complexity.
Choose this device when your design requires a high logic count and dense I/O in a compact 780‑FBGA footprint with a low‑voltage core and commercial temperature operation, enabling streamlined board integration and predictable performance in standard operating environments.
Request a quote or submit an inquiry for the EP4CE75F29C9LN to discuss availability and quantity pricing for your next design. Provide your required quantity and delivery timeline for a prompt response.

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