EP4CE75F29I8LN

The EP4CE75F29I8LN is an Intel Cyclone® IV E field programmable gate array (FPGA) in a 780‑ball FBGA package. It delivers mid‑range programmable logic capacity with substantial on‑chip memory and a high I/O count, targeted for industrial applications and embedded systems requiring robust temperature range and compact packaging.

Key Features

• Core Logic Provides 75,408 logic elements for implementing a wide range of custom digital functions and control logic.
• Embedded Memory Approximately 2.81 Mbits of on‑chip RAM to support buffering, FIFOs, and embedded data storage for real‑time processing.
• I/O Density 426 available I/O pins to support extensive peripheral interfacing and system integration.
• Power Core supply voltage specified from 970 mV to 1.03 V, enabling predictable core power planning and supply design.
• Package & Mounting 780‑FBGA (29 × 29) package in a surface‑mount form factor for high‑density PCB layouts.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Compliance RoHS compliant, supporting regulatory and environmental requirements for lead‑free assemblies.
• Documentation Supported by the Cyclone IV device handbook and datasheet material covering operating conditions, electrical characteristics, and performance specifications.

Typical Applications

• Industrial Control — Use the FPGA for motor control, PLC logic, and machine automation where extended temperature range and I/O density are required.
• Embedded Systems — Implement glue logic, protocol bridging, and custom peripherals leveraging the device’s logic capacity and on‑chip RAM.
• Signal Processing — Deploy for algorithms that benefit from parallel FPGA processing and on‑chip buffering.
• High‑Density I/O Interfaces — Act as an I/O concentrator or interface bridge where many external signals must be aggregated and controlled.

Unique Advantages

• Significant Logic Capacity: 75,408 logic elements enable complex finite‑state machines, datapaths, and control systems without external gate arrays.
• Substantial On‑Chip Memory: Approximately 2.81 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
• High I/O Count: 426 I/O pins provide flexibility to connect sensors, transceivers, and peripherals directly to the FPGA.
• Industrial Reliability: Rated operation from −40 °C to 100 °C supports deployment in harsher environments common to industrial equipment.
• Compact, PCB‑Friendly Package: The 780‑FBGA (29×29) surface‑mount package enables high‑density board designs while maintaining thermal and mechanical stability.
• Regulatory Compliance: RoHS compliance simplifies adoption in lead‑free manufacturing processes.

Why Choose EP4CE75F29I8LN?

The EP4CE75F29I8LN combines mid‑range programmable logic, meaningful on‑chip RAM, and a large I/O complement in a compact 780‑FBGA package rated for industrial temperatures. This balance of capacity, memory, and I/O makes it well suited for engineers building embedded and industrial systems that require deterministic custom logic and reliable operation across a wide temperature range.

Backed by Cyclone IV device documentation, the EP4CE75F29I8LN provides verifiable electrical and timing specifications to support system design, validation, and integration into production assemblies.

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