EP4CE75U19I7N

The EP4CE75U19I7N is a Cyclone IV E field-programmable gate array (FPGA) in a 484-FBGA package designed for applications that require significant programmable logic and high I/O density. The device provides 75,408 logic elements, approximately 2.81 Mbits of embedded memory, and 292 user I/Os in a compact surface-mount package.

With an industrial operating temperature range of −40 °C to 100 °C and a core supply voltage range of 1.15 V to 1.25 V, this FPGA is targeted at designs that need robust thermal performance, extensive on-chip logic and RAM, and a high pin count for complex interfacing.

Key Features

• Core Capacity  75,408 logic elements provide a large programmable fabric for implementing complex digital functions and custom logic architectures.
• On-chip Memory  Approximately 2.81 Mbits of embedded RAM for buffering, FIFOs, and local storage to support data-path and state-machine requirements.
• I/O and Connectivity  292 user I/O pins enable high-density external interfacing for sensors, buses, and peripheral devices.
• Power and Voltage  Core supply voltage range from 1.15 V to 1.25 V to match typical FPGA core power rails and support power sequencing requirements.
• Package and Mounting  484-FBGA (supplier package: 484-UBGA, 19×19) surface-mount package that balances high I/O count with a compact footprint.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation to meet a wide range of environmentally demanding applications.
• Compliance  RoHS compliant.
• Documentation  Device details and electrical/thermal specifications are covered in the Cyclone IV device documentation (Device Handbook, Cyclone IV series).

Typical Applications

• Industrial Control  High I/O count and industrial temperature range make the device suitable for sensor interfacing, motor-control logic, and factory automation systems.
• Communications and Networking  Large logic capacity and embedded RAM support packet processing, protocol bridging, and custom data-path implementations.
• Embedded Systems  Provides programmable glue logic, protocol conversion, and hardware acceleration inside board-level embedded platforms.

Unique Advantages

• High Logic Density:  75,408 logic elements enable implementation of substantial custom logic without external CPLDs or discrete logic.
• Substantial On-Chip Memory:  Approximately 2.81 Mbits of embedded RAM reduces reliance on external memory for many buffering and caching tasks.
• Extensive I/O Count:  292 I/Os provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front-ends.
• Industrial Thermal Range:  Rated from −40 °C to 100 °C for deployments in harsher thermal environments.
• Compact Ball-Grid Package:  484-FBGA (19×19 UBGA) offers a high-pin-count solution in a manageable board footprint.
• Standards Compliance:  RoHS compliance supports environmentally regulated production requirements.

Why Choose EP4CE75U19I7N?

The EP4CE75U19I7N combines a large logic fabric, a substantial amount of embedded RAM, and a high I/O count in a single industrial-grade 484-FBGA package. Its electrical and thermal ratings make it suitable for designers who need a balance of programmable capacity and robust environmental performance.

This device is well suited to engineering teams developing industrial control, communications, and embedded applications that require on-chip memory, high pin-count interfacing, and a broad operating temperature window. Detailed device specifications and operational characteristics are available in the Cyclone IV device documentation for design validation and integration.

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