EP4CE75F29I7N

The EP4CE75F29I7N is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel, providing a scalable programmable logic fabric for embedded system integration. It combines a high logic element count with substantial on-chip memory and a large I/O complement in a compact 780-ball FBGA package.

This device targets designs that require flexible, reconfigurable logic resources and reliable operation across an industrial temperature range, while operating from a core supply between 1.15 V and 1.25 V.

Key Features

• Core Logic  Approximately 75,408 logic elements providing substantial programmable logic capacity for custom digital functions.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM (2,810,880 bits) for implementing FIFOs, buffers, and local storage without external memory.
• I/O Density  426 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and system interconnect requirements.
• Voltage Supply  Core supply range of 1.15 V to 1.25 V to match regulated FPGA power rails.
• Package & Mounting  780-ball FBGA (29 × 29) package in surface-mount format for compact board-level integration.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Design Documentation  Device handbook and datasheet content covers operating conditions, DC characteristics, switching characteristics, and power consumption for design and verification reference.
• RoHS Compliant  Manufactured in accordance with RoHS requirements for environmental compliance.

Typical Applications

• Programmable logic integration  Implement custom digital logic, state machines, and protocol engines using the device's 75,408 logic elements.
• High-density I/O control  Use 426 I/O pins for multi-channel sensor interfaces, parallel buses, and system-level signal routing.
• Memory-centric designs  Leverage approximately 2.81 Mbits of embedded RAM for local buffering, packet processing, and temporary storage without immediate external memory.
• Industrial deployments  Industrial-grade temperature range and surface-mount 780-FBGA packaging support demanding environmental and form-factor requirements.

Unique Advantages

• High logic density: Approximately 75,408 logic elements enable complex designs and consolidation of multiple functions into a single FPGA.
• Substantial on-chip memory: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory, simplifying board design and improving throughput for local storage tasks.
• Extensive I/O resources: 426 I/O pins provide flexibility to connect to numerous peripherals and parallel interfaces without external multiplexing.
• Industrial temperature support: Rated from −40 °C to 100 °C, suitable for systems requiring broad temperature resilience.
• Compact, serviceable package: 780-ball FBGA (29×29) offers a high-pin-count solution in a compact surface-mount footprint for dense PCBs.
• Standards-compliant manufacturing: RoHS compliance supports environmentally responsible product design and procurement.

Why Choose EP4CE75F29I7N?

The EP4CE75F29I7N delivers a balanced combination of programmable logic capacity, embedded memory, and high I/O count in a compact 780-FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust, long-life applications where environmental tolerance and regulatory alignment are important.

This device is well suited for engineers and procurement teams building systems that require on-board reconfigurable logic, significant on-chip RAM, and extensive connectivity, while maintaining a compact form factor and controlled core-voltage requirements.

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