EP4CE75F29I8L

The EP4CE75F29I8L is a Cyclone® IV E Field Programmable Gate Array (FPGA) from Intel, delivered in a 780-ball BGA package with a 29×29 supplier FBGA footprint. It provides a balanced combination of programmable logic, embedded memory and high I/O density for industrial designs.

With 75,408 logic elements, approximately 2.81 Mbits of embedded memory and 426 I/O pins, this device is aimed at applications that require substantial on-chip logic and memory capacity, broad interfacing capability, and operation across an extended temperature range.

Key Features

• FPGA Core – Cyclone IV E architecture offering programmable logic resources for custom hardware implementations.
• Logic Capacity – 75,408 logic elements available to implement complex digital functions and state machines.
• Embedded Memory – Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Density – 426 I/O pins to support multiple interfaces, parallel buses and broad system connectivity.
• Power Supply – Core voltage specified from 970 mV to 1.03 V for the device core supply requirements.
• Package & Mounting – 780-BGA (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for compact PCB integration.
• Temperature Range – Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliance – Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Industrial Automation – Implement motor control logic, sensor interfacing and real-time control functions using the device’s logic capacity and extended temperature rating.
• Communications & Networking – Use the high I/O count and on-chip memory for protocol bridging, packet buffering and custom interface logic.
• Embedded Systems – Integrate glue logic, custom peripherals and local data buffering within compact, surface-mount designs.
• Test & Measurement – Build programmable signal handling, data capture and preprocessing blocks leveraging the FPGA’s logic and memory resources.

Unique Advantages

• Substantial Logic Density: 75,408 logic elements enable implementation of large custom hardware functions without external ASICs.
• Significant On-Chip Memory: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory for many buffering and streaming tasks.
• High Pin Count for System Integration: 426 I/Os simplify board-level connectivity and reduce the need for external multiplexing solutions.
• Industrial Temperature Capability: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 780-FBGA (29×29) package provides a high-density solution for space-constrained PCBs.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP4CE75F29I8L?

The EP4CE75F29I8L delivers a blend of logic capacity, embedded memory and extensive I/O in a compact 780-ball BGA package, making it suitable for industrial and embedded applications that require programmable hardware and broad interfacing. Its defined core voltage range and −40 °C to 100 °C operating window align the device to robust system designs that demand predictable electrical and thermal behavior.

This part is well-suited for design teams needing a scalable FPGA fabric with on-chip memory and high pin count for integrating multiple peripherals and interfaces, while maintaining a compact surface-mount footprint and RoHS compliance.

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