EP4CGX110CF23C7N

The EP4CGX110CF23C7N is a Cyclone® IV GX field programmable gate array (FPGA) IC from Intel designed for configurable digital logic applications. It combines a high logic element count with embedded RAM and a substantial I/O complement in a compact 484-BGA surface-mount package.

With a nominal supply range of 1.16 V to 1.24 V and a commercial operating temperature range of 0 °C to 85 °C, this device is suited to mainstream electronic designs that require significant on-chip logic and memory capacity along with RoHS compliance.

Key Features

• Core Capacity  Provides 109,424 logic elements and 6,839 logic array blocks (LABs) for implementing large-scale, custom digital logic.
• Embedded Memory  Approximately 5.62 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O  Up to 270 user I/O pins to accommodate a wide range of external interfaces and signal routing needs.
• Power  Operates from a specified supply range of 1.16 V to 1.24 V for core power planning and system design.
• Package & Mounting  484-ball BGA footprint (supplier package: 484-FBGA, 23×23) optimized for surface-mount assembly.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Programmable Logic Integration  Implement custom digital functions and hardware acceleration where significant logic density and on-chip RAM are required.
• I/O-Intensive Interfaces  Handle designs requiring many external signals, leveraging up to 270 I/O pins for protocol bridging and peripheral connectivity.
• Embedded Memory-Dependent Functions  Use the device’s embedded RAM for buffering, lookup tables, and small data storage without immediate need for external memory.

Unique Advantages

• High Logic Density: 109,424 logic elements provide capacity for complex, integrated digital designs without partitioning across multiple devices.
• On-Chip Memory: Approximately 5.62 Mbits of embedded RAM reduces dependency on external memory and simplifies board-level design.
• Substantial I/O Count: 270 I/O pins enable flexible interfacing to peripherals, sensors, and communication links.
• Compact BGA Packaging: 484-ball FBGA (23×23) balances high pin count and a small PCB footprint for dense system layouts.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for mainstream electronic products and applications within standard commercial environments.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and product deployment.

Why Choose EP4CGX110CF23C7N?

The EP4CGX110CF23C7N delivers a combination of large programmable logic capacity, on-chip memory, and a high I/O count in a compact 484-BGA surface-mount package. Its 1.16 V to 1.24 V supply range and commercial temperature rating make it appropriate for mainstream electronic designs that prioritize integration and board-level density.

This Intel Cyclone® IV GX FPGA is suited for engineers and designers who need substantial on-chip resources—logic elements, embedded RAM, and extensive I/O—while maintaining RoHS compliance and compact packaging for system-level integration.

Request a quote or submit an inquiry to receive pricing and availability for EP4CGX110CF23C7N and to discuss how it fits your design requirements.