EP4CGX110CF23I7

The EP4CGX110CF23I7 is an Intel Cyclone® IV GX FPGA providing 109,424 logic elements and approximately 5.62 Mbits of embedded memory. The device is supplied in a 484‑BGA (484‑FBGA, 23×23) surface‑mount package and exposes 270 general‑purpose I/Os.

Designed and specified for industrial environments, the device operates from 1.16 V to 1.24 V and across an operating temperature range of −40 °C to 100 °C. RoHS compliance is included.

Key Features

• Logic Capacity 109,424 logic elements provide substantial programmable logic resources for complex FPGA designs.
• On‑Chip Memory Approximately 5.62 Mbits of total embedded RAM bits for buffering, state storage, and lookup tables.
• I/O Count 270 I/O pins support a wide range of external interfaces and board-level connectivity.
• Power Voltage supply range of 1.16 V to 1.24 V for core operation.
• Package & Mounting 484‑BGA package (supplier device package: 484‑FBGA, 23×23) in a surface‑mount form factor for compact board integration.
• Industrial Temperature Grade Specified for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Environmental Compliance RoHS‑compliant construction to meet common environmental requirements.

Unique Advantages

• High logic density: 109,424 logic elements enable implementation of sizable digital designs without external logic expansion.
• Substantial embedded memory: Approximately 5.62 Mbits of on‑chip RAM supports buffering and local data storage, reducing external memory dependency.
• Generous I/O availability: 270 I/Os allow for broad peripheral interfacing and flexible board routing options.
• Industrial temperature support: −40 °C to 100 °C rating helps maintain operation across demanding temperature conditions.
• Compact BGA footprint: 484‑FBGA (23×23) surface‑mount package provides a dense, manufacturable solution for space‑constrained PCBs.
• Regulatory conformity: RoHS compliance supports deployments requiring restricted‑substance conformance.

Why Choose EP4CGX110CF23I7?

The EP4CGX110CF23I7 combines a high logic element count, sizable embedded RAM, and a large I/O complement in a compact 484‑BGA surface‑mount package, offering a well‑balanced platform for complex programmable logic tasks within industrial environments. Its specified core voltage range and extended operating temperature make it suitable for designs that demand consistent electrical and thermal performance.

This FPGA is appropriate for engineering teams and procurement seeking a high‑density, RoHS‑compliant Intel Cyclone IV GX device with explicit industrial temperature coverage and a compact board footprint, providing a predictable and supported component option for medium to large FPGA implementations.

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