EP4CGX110DF27C7N

The EP4CGX110DF27C7N is an Intel Cyclone® IV GX field-programmable gate array (FPGA) supplied in a 672-ball BGA package. It delivers high logic capacity, substantial on-chip memory, and a large I/O count in a surface-mount 672-FBGA (27×27) footprint.

Engineered for commercial-grade applications, this device is suitable for designs that require dense programmable logic, embedded RAM for buffering or data storage, and extensive external interfacing while operating within a 0 °C to 85 °C range.

Key Features

• Logic Capacity  Approximately 109,424 logic elements, providing a high platform for complex digital designs and custom signal processing.
• Embedded Memory  Approximately 5.62 Mbits of on-chip RAM, enabling local buffering and memory-intensive functions without immediate external RAM dependency.
• I/O Resources  393 I/O pins to support high channel-count interfaces and diverse peripheral connections.
• Package and Mounting  672-BGA (672-FBGA, 27×27) surface-mount package for compact board-level integration in space-constrained designs.
• Power Supply  Core voltage supply range of 1.16 V to 1.24 V, suitable for designs targeting the specified core operating window.
• Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Digital Logic and Prototyping  Use the device to implement complex state machines, protocol adapters, and application-specific logic where a high count of logic elements is required.
• High I/O Interface Bridging  Ideal for board designs that need many external connections—parallel buses, multi-channel I/O aggregation, or peripheral expansion—leveraging 393 available I/Os.
• On-Chip Buffering and Packet Handling  Embedded memory (≈5.62 Mbits) supports buffering, FIFO implementation, and temporary storage for data-path and packet-processing tasks.

Unique Advantages

• High Logic Density:  Approximately 109,424 logic elements enable implementation of complex functions and larger designs on a single device, reducing the need for multiple FPGAs.
• Substantial Embedded Memory:  Around 5.62 Mbits of on-chip RAM provides local storage for buffering and intermediate data processing, simplifying external memory requirements.
• Extensive I/O Count:  393 I/Os facilitate multi-channel interfacing and flexible integration with external peripherals and subsystems.
• Compact Surface-Mount Package:  672-FBGA (27×27) offers a high-pin-count solution in a compact form factor for space-sensitive PCB layouts.
• Commercial-Grade Operation:  Rated for 0 °C to 85 °C operation, suitable for standard commercial electronics deployments.
• Regulatory Compliance:  RoHS-compliant construction supports regulatory and environmental requirements for many commercial products.

Why Choose EP4CGX110DF27C7N?

The EP4CGX110DF27C7N combines high logic capacity, significant embedded RAM, and a large I/O complement in a compact 672-BGA surface-mount package, delivering a balanced platform for complex commercial FPGA designs. Manufactured by Intel, it targets applications that require dense programmable logic and ample on-chip memory while operating within a commercial temperature range.

This device is well suited for design teams needing a single-device solution that reduces board-level component count and provides the logic and memory resources to implement advanced digital functions, interface aggregation, and buffering without immediate reliance on extensive external components.

Request a quote or submit an inquiry to receive pricing and availability for the EP4CGX110DF27C7N. Our team can provide lead-time information and assistance to help integrate this Cyclone IV GX FPGA into your next design.