EP4CGX110DF27I7

The EP4CGX110DF27I7 is an Intel Cyclone IV GX field programmable gate array (FPGA) supplied in a 672-ball BGA package. It delivers a large programmable fabric with high I/O count and on-chip memory for designs that require substantial logic capacity and flexible I/O integration.

With an industrial temperature grade and a tightly specified core supply range, this device targets applications that need reliable operation across extended temperatures while providing significant programmable resources and onboard RAM.

Key Features

• Logic Capacity — 109,424 logic elements and 6,839 logic blocks provide extensive programmable resources for complex digital designs.
• Embedded Memory — Approximately 5.62 Mbits of on-chip RAM to support buffering, state storage, and data-path acceleration without external memory.
• I/O Resources — 393 dedicated I/O pins to support a wide range of parallel interfaces and high-pin-count connectivity requirements.
• Power Supply — Core voltage supply specified at 1.16 V to 1.24 V, enabling deterministic power planning for system design.
• Package & Mounting — Surface-mount 672-BGA package (supplier device package: 672-FBGA, 27×27) for compact, board-level integration.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for reliable performance in extended-temperature environments.
• Regulatory Status — RoHS compliant.

Typical Applications

• Industrial Control — Large logic capacity and industrial temperature rating support control, sequencing, and I/O aggregation in factory automation and equipment control systems.
• Communications Interfaces — High I/O count and sizable on-chip RAM enable protocol handling, data buffering, and interface bridging in communications and networking equipment.
• Embedded Processing Acceleration — Substantial logic and embedded memory allow offloading of compute or data-path tasks in embedded systems and digital signal processing applications.

Unique Advantages

• High Logic Density: 109,424 logic elements let designers map complex functions into a single FPGA, reducing external logic and system BOM.
• Significant On-Chip RAM: Approximately 5.62 Mbits of embedded memory minimizes the need for external memory for many buffering and state-storage needs.
• Robust I/O Count: 393 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and high-pin-count connectors.
• Industrial Temperature Qualification: −40 °C to 100 °C operating range supports deployment in ambient and industrial environments where extended-temperature operation is required.
• Board-Level Integration: 672-BGA surface-mount package (672-FBGA, 27×27) enables dense PCB layouts while maintaining substantial pinout for system connectivity.

Why Choose EP4CGX110DF27I7?

The EP4CGX110DF27I7 positions itself as a high-capacity Cyclone IV GX FPGA option for designs that demand abundant programmable logic, on-chip RAM, and broad I/O capability within an industrial-temperature envelope. Its combination of logic density, embedded memory, and a compact 672-BGA package makes it suitable for systems that require integration of complex digital functions without expanding board count.

This device is well suited for engineers and teams building robust embedded and industrial systems that benefit from a proven FPGA architecture, predictable core voltage requirements, and RoHS compliance for manufacturability and regulatory alignment.

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