EP4CGX110DF27I7N

The EP4CGX110DF27I7N is an Intel Cyclone® IV GX field programmable gate array (FPGA) supplied in a 672-ball BGA package. It delivers a large logic fabric and on-chip memory with a high I/O count for complex, custom digital designs.

With 109,424 logic elements, approximately 5.6 Mbits of embedded memory, and 393 I/O pins, this industrial-grade device targets applications that require substantial programmable logic density, significant embedded RAM, and broad external connectivity within a surface-mount 672-FBGA (27×27) footprint.

Key Features

• Logic Resources  Approximately 109,424 logic elements provide the programmable fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory  Approximately 5.6 Mbits of on-chip RAM support data buffering, FIFOs, and local storage for high-throughput designs.
• I/O Capacity  393 user I/O pins enable extensive interfacing to external peripherals, sensors, and high-pin-count system designs.
• Package & Mounting  672-ball FBGA in a 27×27 mm footprint, designed for surface-mount assembly to support dense board-level integration.
• Power  Device core voltage range specified at 1.16 V to 1.24 V to match system power-rail design targets.
• Thermal & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance  RoHS-compliant construction for environmental and manufacturing requirements.
• Manufacturer  Produced by Intel, identifying the device family and vendor for sourcing and documentation.

Typical Applications

• Industrial Control & Automation  Use the device’s industrial temperature rating, high logic capacity, and extensive I/O for custom control, signal processing, and interface tasks in factory and process automation equipment.
• Communications & Networking  Large logic resources and embedded memory support protocol processing, packet buffering, and parallel interface implementation in networking modules and switches.
• Embedded Processing & Prototyping  High density of logic elements and on-chip RAM make the device suitable for hardware prototyping, algorithm acceleration, and system integration tasks.

Unique Advantages

• High Logic Density:  Roughly 109,424 logic elements enable implementation of complex, multi-function designs on a single device, reducing board-level component count.
• Significant On-Chip Memory:  Approximately 5.6 Mbits of embedded RAM provides local buffering and storage to improve data throughput and reduce external memory dependence.
• Extensive I/O:  393 I/O pins allow flexible interfacing to a wide range of peripherals and high-pin-count systems without additional IO expanders.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C for reliable operation across demanding environmental conditions.
• Compact BGA Package:  672-FBGA (27×27) surface-mount package supports dense PCB layouts and modern assembly processes.
• RoHS Compliant:  Manufactured to RoHS standards to meet environmental requirements in global markets.

Why Choose EP4CGX110DF27I7N?

The EP4CGX110DF27I7N positions itself as a high-density, industrial-grade FPGA solution that balances extensive programmable logic, substantial embedded memory, and a large I/O complement in a compact 672-ball FBGA package. Its specified core voltage range and wide operating temperature make it suitable for engineered systems that require predictable electrical and environmental behavior.

This device is well suited to design teams and procurement professionals building complex digital systems—where integration, I/O flexibility, and on-chip memory are key drivers. Choosing this FPGA supports scalable hardware implementations while leveraging Intel’s Cyclone® IV GX device family characteristics for consistent sourcing and documentation.

Request a quote or submit an inquiry to receive pricing and availability information for EP4CGX110DF27I7N and to discuss how this FPGA can be integrated into your next project.