EP4CGX110DF31C7

The EP4CGX110DF31C7 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high count of logic elements and embedded memory in a compact 896-BGA package for surface-mount board designs.

With 109,424 logic elements, approximately 5.6 Mbits of embedded memory, and 475 I/O pins, this commercial-grade device targets designs that require dense logic resources, substantial on-chip RAM, and broad I/O connectivity while operating within a 0 °C to 85 °C temperature range.

Key Features

• FPGA Core Cyclone® IV GX field programmable gate array architecture provided by Intel for configurable digital logic implementation.
• Logic Capacity Approximately 109,424 logic elements to implement complex custom logic, glue logic, and control functions.
• Embedded Memory Approximately 5.6 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage for processing tasks.
• I/O Density 475 I/O pins to enable wide peripheral connectivity and parallel interfaces.
• Package & Mounting 896-BGA package (supplier package: 896-FBGA, 31 × 31) designed for surface-mount assembly on modern PCBs.
• Power Supply Core supply range 1.16 V to 1.24 V for integration into regulated power domains.
• Operating Conditions Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density logic implementations — Deploy complex combinational and sequential logic functions using the device's large logic element count.
• Memory-intensive subsystems — Use the approximately 5.6 Mbits of embedded RAM for buffering, packet storage, or intermediate data processing.
• High-I/O connectivity — Leverage 475 I/O pins for multi-interface designs and parallel signal routing.

Unique Advantages

• Substantial logic resources: The 109,424 logic elements enable implementation of large-scale custom logic without immediate need for multiple devices.
• Significant on-chip RAM: Approximately 5.6 Mbits of embedded memory reduces dependence on external RAM for many buffering and data handling tasks.
• High I/O count: 475 I/O pins support complex board-level integration and multiple concurrently routed interfaces.
• Compact BGA footprint: The 896-BGA (31×31) package delivers high integration density for space-constrained PCBs while supporting surface-mount assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic products and prototypes.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose EP4CGX110DF31C7?

The EP4CGX110DF31C7 combines large logic capacity, sizable embedded memory, and extensive I/O in a single, surface-mount 896-BGA package. Its electrical and thermal specifications — including a 1.16 V to 1.24 V supply range and 0 °C to 85 °C operating temperature — make it a practical choice for commercial designs that need integrated digital logic, on-chip RAM, and broad connectivity.

Engineers and procurement teams seeking a high-density FPGA solution with verified RoHS compliance and a compact board-level footprint will find this Intel Cyclone® IV GX device well suited for complex designs where consolidation of logic and memory resources is important.

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