EP4CGX110DF27C8

The EP4CGX110DF27C8 is a Cyclone® IV GX family Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers high logic capacity and on-chip memory in a compact 672-BGA package, suitable for designs that require substantial programmable logic, embedded RAM, and a large I/O count.

This device is targeted at commercial-grade applications and is specified for a 1.16 V to 1.24 V supply range and an operating temperature range of 0 °C to 85 °C, supporting board-level integration where space-efficient packaging and high I/O density are important.

Key Features

• Cyclone IV GX FPGA Family Identified as part of the Cyclone IV GX series, offering a programmable fabric for custom digital logic implementations.
• High Logic Capacity Provides 109,424 logic elements to implement complex digital functions and large-scale logic designs.
• Embedded Memory Approximately 5.6 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
• Extensive I/O 393 user I/O pins enable wide interface support and parallel connectivity for board-level systems.
• Compact Package Available in a 672-BGA package (supplier device package: 672-FBGA, 27×27) with surface-mount mounting for dense PCB layouts.
• Power Specification Operates from a specified voltage supply range of 1.16 V to 1.24 V for core power planning.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for standard commercial environments.
• RoHS Compliant Meets RoHS environmental requirements for restricted substances.

Typical Applications

• High-density digital designs — Implement complex custom logic using the device's 109,424 logic elements for algorithm acceleration and control logic.
• Memory-intensive functions — Utilize approximately 5.6 Mbits of embedded RAM for buffering, packet storage, or state machine resources.
• I/O-rich interface implementations — Support multiple parallel interfaces, protocol bridging, or multi-channel data paths with 393 I/O pins.
• Space-constrained board designs — Leverage the 672-BGA surface-mount package for compact PCB layouts requiring significant logic and connectivity.

Unique Advantages

• Substantial logic resources: 109,424 logic elements reduce the need for external glue logic and enable consolidated system functions on a single device.
• Significant on-chip memory: Approximately 5.6 Mbits of embedded RAM supports local buffering and state retention without external memory.
• High I/O density: 393 I/O pins accommodate multiple interfaces and parallel data channels directly from the FPGA.
• Compact, production-ready package: 672-BGA (27×27) surface-mount packaging simplifies PCB routing while maintaining thermal and mechanical stability for commercial applications.
• Predictable power envelope: Narrow core supply range (1.16 V–1.24 V) assists power-supply design and voltage budgeting on the board.
• RoHS compliance: Meets environmental substance restrictions for global commercial manufacturing requirements.

Why Choose EP4CGX110DF27C8?

The EP4CGX110DF27C8 combines large-scale programmable logic, substantial embedded memory, and a high I/O count in a compact 672-BGA package, making it well suited to commercial designs that demand integration of multiple digital functions on a single FPGA. Its specified voltage and temperature ranges provide clear parameters for system power and thermal planning.

This part is manufactured by Intel and is appropriate for customers looking to consolidate logic, memory, and connectivity into a single, surface-mount FPGA device for streamlined board-level implementations and predictable design integration.

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