EP4CGX110DF27C7

IC FPGA 393 I/O 672FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 393 5621760 109424 672-BGA

Quantity 1,728 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O393Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6839Number of Logic Elements/Cells109424
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5621760

Overview of EP4CGX110DF27C7 – Cyclone® IV GX FPGA, 109,424 Logic Elements, 672-BGA

The EP4CGX110DF27C7 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) from Intel designed for commercial applications requiring a high count of programmable logic, on-chip memory, and extensive I/O. The device integrates 109,424 logic elements, approximately 5.62 Mbits of embedded memory, and 393 general-purpose I/O, delivering a dense, reconfigurable fabric for custom digital logic implementations.

Packaged in a 672-ball BGA (672-FBGA, 27×27) and specified for surface-mount assembly, this FPGA operates from a core supply range of 1.16 V to 1.24 V and is rated for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

  • Core Logic 109,424 logic elements provide a large programmable fabric for implementing complex digital designs and custom datapaths.
  • Logic Blocks 6,839 logic blocks support partitioning and structuring of designs for efficient resource utilization.
  • Embedded Memory Approximately 5.62 Mbits of on-chip RAM enable local buffering, FIFOs, and memory-intensive algorithms without external memory dependence.
  • I/O Capacity 393 general-purpose I/O pins permit extensive external interfacing and high-density signal connectivity.
  • Power and Voltage Core supply operating range of 1.16 V to 1.24 V supports integration with standard power rails in commercial systems.
  • Package and Mounting 672-BGA (672-FBGA, 27×27) package in a surface-mount format for compact board integration and high pin-count routing.
  • Operating Range and Compliance Commercial grade operation from 0 °C to 85 °C and RoHS compliance for environmental suitability in commercial products.

Typical Applications

  • Custom digital logic and prototyping — Use the device to implement bespoke state machines, finite-impulse-response filters, and custom accelerators for product development and proof-of-concept designs.
  • Data aggregation and preprocessing — Leverage abundant logic and on-chip memory to collect, buffer, and preprocess parallel data streams before handing off to system processors.
  • High-density I/O bridging — With 393 I/O pins, the FPGA can function as an interface concentrator, protocol bridge, or aggregator between multiple peripherals and system controllers.
  • Embedded control and sequencing — Implement control logic, timing, and sequencing functions for commercial equipment and consumer devices that require flexible, reprogrammable behavior.

Unique Advantages

  • Large programmable capacity: 109,424 logic elements provide substantial room for complex designs and parallel implementations.
  • Significant on-chip memory: Approximately 5.62 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
  • Extensive I/O count: 393 general-purpose I/Os enable high pin-count interfacing for multi-sensor, multi-peripheral, or multi-protocol applications.
  • Compact, high-pin package: 672-BGA (672-FBGA, 27×27) balances routing density and board area for space-constrained designs.
  • Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product development.

Why Choose EP4CGX110DF27C7?

The EP4CGX110DF27C7 positions itself as a high-capacity, commercially rated FPGA for designers who need a large programmable fabric, ample embedded memory, and broad I/O connectivity in a compact BGA package. Its combination of 109,424 logic elements, approximately 5.62 Mbits of on-chip RAM, and 393 I/O pins makes it suitable for complex digital logic, data preprocessing, and interface consolidation tasks in commercial designs.

Engineers and procurement teams looking for a reconfigurable device with substantial on-chip resources and a well-defined commercial operating range will find this Cyclone® IV GX part suited to scalable designs that benefit from reprogrammability and dense integration.

Request a quote or submit an inquiry to receive pricing and availability information for EP4CGX110DF27C7.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up