EP4CGX110DF27C8N

The EP4CGX110DF27C8N is an Intel Cyclone® IV GX field programmable gate array (FPGA) offered in a 672-ball BGA package. It delivers high logic capacity, substantial embedded memory, and a large number of I/Os in a commercial-grade, surface-mount FPGA footprint.

Designed for applications that require dense programmable logic and on-chip memory, this device combines 109,424 logic elements, approximately 5.62 Mbits of embedded memory, and 393 I/Os while operating from a 1.16 V to 1.24 V supply and a 0 °C to 85 °C temperature range.

Key Features

• Core Architecture: Cyclone® IV GX family FPGA—programmable logic optimized for integration in systems requiring substantial on-chip resources.
• Logic Capacity: 109,424 logic elements to implement complex digital functions and state machines within a single device.
• Embedded Memory: Approximately 5.62 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Resources: 393 user I/O pins to support wide parallel interfaces and multiple external peripherals.
• Power: Core supply range of 1.16 V to 1.24 V to match system power rails and enable predictable power design.
• Package and Mounting: 672-BGA (Supplier package: 672-FBGA, 27×27) in a surface-mount form factor for compact, board-level integration.
• Operating Range and Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Custom digital logic and prototyping — Use the device’s 109,424 logic elements and on-chip memory to prototype and implement complex custom logic architectures.
• High-density I/O interfacing — 393 I/Os provide the pins needed for parallel interfaces, multi-channel sensor arrays, and board-level I/O aggregation.
• Embedded buffering and data handling — Approximately 5.62 Mbits of embedded RAM supports local buffering, FIFOs, and temporary data storage in throughput-sensitive designs.

Unique Advantages

• High logic density: 109,424 logic elements enable consolidation of multi-chip logic into a single FPGA, reducing overall system complexity.
• Significant on-chip memory: Approximately 5.62 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O count: 393 I/Os support rich connectivity and simplify routing of parallel and multi-channel interfaces.
• Compact package: 672-BGA (672-FBGA, 27×27) allows for high-density PCB designs while maintaining surface-mount assembly compatibility.
• Commercial-grade operation: Specified for 0 °C to 85 °C operation and RoHS compliance for regulatory alignment.

Why Choose EP4CGX110DF27C8N?

The EP4CGX110DF27C8N delivers a balance of large logic capacity, ample embedded memory, and broad I/O in a compact 672-BGA package—making it suitable for systems that need to integrate complex programmable logic without expanding board real estate. Its commercial temperature grading and RoHS compliance provide predictable integration into mainstream electronic products.

This device is a practical choice for designers seeking scalable programmable resources with substantial on-chip RAM and high I/O density, enabling consolidation of functions and streamlined BOMs while maintaining standard surface-mount assembly workflows.

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