EP4CGX110DF31C7N

The EP4CGX110DF31C7N from Intel is a Cyclone® IV GX field programmable gate array (FPGA) supplied in an 896-ball BGA package. This commercial-grade FPGA provides a balance of programmable logic capacity, embedded memory, and rich I/O suitable for applications that require medium-to-high logic density and flexible I/O connectivity.

Key Features

• Core Logic 109,424 logic elements provide substantial on-chip programmable logic for implementing complex digital functions and custom datapaths.
• Embedded Memory Approximately 5.62 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic without relying solely on external memory.
• I/O Capacity 475 I/O pins to accommodate multiple parallel interfaces, control signals, and peripheral connections directly from the FPGA.
• Power Supply Operates from a core voltage supply between 1.16 V and 1.24 V, enabling defined power domain planning for system integration.
• Package and Mounting Available in an 896-BGA package (supplier designation: 896-FBGA, 31×31) with surface-mount mounting for automated PCB assembly.
• Operating Range Commercial operating temperature range of 0 °C to 85 °C for typical commercial electronics environments.
• Compliance RoHS compliant to address common environmental regulatory requirements.

Typical Applications

• Custom Logic and Prototyping — Use the device's 109,424 logic elements to implement and validate custom digital logic, state machines, and prototype system architectures.
• Memory-Intensive Functions — Approximately 5.62 Mbits of embedded RAM support buffering, data storage, and packet handling inside the FPGA fabric.
• I/O-Intensive Systems — The 475 I/O pins enable direct interfacing with multiple peripherals, sensors, or parallel buses without extensive external multiplexing.
• Board-Level Integration — The 896-BGA surface-mount package suits compact board layouts where high pin count and dense integration are required.

Unique Advantages

• High Logic Density: 109,424 logic elements enable consolidation of complex functions into a single device, simplifying board-level design.
• Substantial On-Chip Memory: Approximately 5.62 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O Footprint: 475 I/O pins give flexibility for connecting multiple interfaces and peripherals directly to the FPGA fabric.
• Defined Power Envelope: Narrow core voltage range (1.16 V–1.24 V) simplifies power supply planning and domain definition in system designs.
• Commercial-Grade Availability: Specified for 0 °C to 85 °C operation and RoHS compliant, suitable for a wide range of commercial electronics applications.

Why Choose EP4CGX110DF31C7N?

The EP4CGX110DF31C7N delivers a combination of high logic capacity, meaningful embedded memory, and a large I/O count in an industry-standard 896-BGA package. Its defined voltage range and commercial operating temperature make it a practical choice for designers building medium-to-high complexity digital systems that require on-chip resources and extensive board-level connectivity.

For teams focused on consolidation, flexibility, and predictable integration, this Intel Cyclone® IV GX device offers a balanced platform that supports scalable designs while aligning with common commercial product requirements and RoHS environmental compliance.

Request a quote or submit an inquiry for EP4CGX110DF31C7N to get pricing and availability information for your next design.