EP4CGX110DF31C8

The EP4CGX110DF31C8 is a Cyclone® IV GX field-programmable gate array (FPGA) from Intel, delivered in a 896-ball BGA package. It provides a large array of programmable logic resources and embedded memory suitable for designs that require substantial on-chip logic and I/O capacity.

This commercial-grade device supports a supply voltage range of 1.16 V to 1.24 V, comes RoHS compliant, and is specified for operation from 0 °C to 85 °C. Its surface-mount 896-FBGA (31×31) package supports high-density board integration.

Key Features

• Logic Capacity  Approximately 109,424 logic elements to implement complex user-defined digital functions.
• Embedded Memory  Approximately 5.62 Mbits of on-chip RAM for buffering, state storage, and local memory needs.
• I/O Resources  475 available I/O pins to support extensive peripheral and interface connectivity.
• Package & Mounting  896-ball BGA (896-FBGA, 31×31) in a surface-mount configuration for compact, high-density PCB layouts.
• Power  Nominal core supply range of 1.16 V to 1.24 V to match system power-rail design requirements.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliance  Manufactured in compliance with RoHS environmental requirements.

Typical Applications

• Custom Digital Logic  Implement user-defined datapaths, control logic, and finite-state machines using the device’s 109,424 logic elements.
• Memory-Intensive Functions  Leverage approximately 5.62 Mbits of embedded memory for buffering, FIFO storage, and on-chip data handling.
• I/O-Heavy Systems  Support multiple external interfaces and peripherals with 475 I/O pins for complex connectivity requirements.
• Compact Board Designs  Use the 896-FBGA (31×31) surface-mount package to integrate high logic density in space-constrained PCB layouts.

Unique Advantages

• High Logic Density: The device’s 109,424 logic elements enable implementation of large-scale custom logic without external CPLDs or additional FPGAs.
• Significant On-Chip Memory: Approximately 5.62 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O Count: 475 I/Os provide flexibility to connect numerous peripherals, sensors, and interface standards.
• Compact BGA Packaging: The 896-FBGA (31×31) format supports high routing density while conserving board area.
• Commercial Temperature Suitability: Specified operation from 0 °C to 85 °C for mainstream commercial product designs.
• RoHS-Compliant Manufacturing: Environmentally compliant production for designs requiring RoHS adherence.

Why Choose EP4CGX110DF31C8?

The EP4CGX110DF31C8 is positioned for designs that require substantial programmable logic, significant on-chip memory, and a large number of I/Os in a compact surface-mount BGA package. Its combination of 109,424 logic elements, approximately 5.62 Mbits of embedded RAM, and 475 I/Os makes it well suited to complex digital implementations that benefit from high integration.

With a defined commercial temperature range and RoHS compliance, this Cyclone® IV GX FPGA offers a balanced option for engineering teams seeking high-capacity programmable logic with well-documented electrical and mechanical characteristics.

Request a quote or submit an inquiry for pricing and availability of EP4CGX110DF31C8 to begin integrating this FPGA into your next design.