EP4CGX150CF23C7

IC FPGA 270 I/O 484FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 270 6635520 149760 484-BGA

Quantity 713 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O270Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9360Number of Logic Elements/Cells149760
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6635520

Overview of EP4CGX150CF23C7 – Cyclone® IV GX FPGA, 484-BGA

The EP4CGX150CF23C7 is a Cyclone® IV GX field-programmable gate array (FPGA) IC manufactured by Intel. It provides a high logic-capacity FPGA in a compact 484-FBGA (23×23) surface-mount package for commercial-grade electronic designs.

Key on-chip resources include 149,760 logic elements, approximately 6.64 Mbits of embedded memory (6,635,520 bits), and 270 user I/O pins. The device operates from a core supply range of 1.16 V to 1.24 V and is specified for 0 °C to 85 °C operation.

Key Features

  • Core / Architecture  Cyclone IV GX field-programmable logic with 149,760 logic elements for complex digital designs.
  • Embedded Memory  Approximately 6.64 Mbits of on-chip RAM (6,635,520 bits) to support data buffering, FIFOs, and local storage.
  • I/O Resources  270 general-purpose I/O pins to interface with peripherals, sensors, and external memory devices.
  • Power  Core voltage supply range of 1.16 V to 1.24 V, enabling defined power provisioning for the FPGA core.
  • Package & Mounting  484-FBGA (23×23) package in a surface-mount form factor for space-efficient board integration.
  • Temperature & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 149,760 logic elements provide large capacity for complex FPGA implementations and parallel processing tasks.
  • Substantial on-chip memory: Approximately 6.64 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Ample I/O count: 270 I/Os deliver flexible connectivity for multi-interface designs and system integration.
  • Compact surface-mount package: 484-FBGA (23×23) enables a small PCB footprint while supporting high pin-count routing.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard consumer and industrial-adjacent electronic products.
  • RoHS compliant: Conforms to common lead-free manufacturing requirements.

Why Choose EP4CGX150CF23C7?

The EP4CGX150CF23C7 offers a balance of high logic capacity, significant embedded memory, and extensive I/O in a compact 484-FBGA surface-mount package. As part of Intel’s Cyclone IV GX family, it is suited to commercial electronic designs that require substantial programmable logic resources and on-chip RAM while maintaining a modest board footprint.

Designers and procurement teams who need a commercial-grade FPGA with defined supply and temperature ranges will find this device appropriate for applications that demand large FPGA fabrics, extensive I/O, and RoHS compliance.

Request a quote or submit a pricing inquiry for EP4CGX150CF23C7 to receive availability and ordering information.

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