EP4CGX150CF23C7
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 270 6635520 149760 484-BGA |
|---|---|
| Quantity | 713 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 270 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9360 | Number of Logic Elements/Cells | 149760 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6635520 |
Overview of EP4CGX150CF23C7 – Cyclone® IV GX FPGA, 484-BGA
The EP4CGX150CF23C7 is a Cyclone® IV GX field-programmable gate array (FPGA) IC manufactured by Intel. It provides a high logic-capacity FPGA in a compact 484-FBGA (23×23) surface-mount package for commercial-grade electronic designs.
Key on-chip resources include 149,760 logic elements, approximately 6.64 Mbits of embedded memory (6,635,520 bits), and 270 user I/O pins. The device operates from a core supply range of 1.16 V to 1.24 V and is specified for 0 °C to 85 °C operation.
Key Features
- Core / Architecture Cyclone IV GX field-programmable logic with 149,760 logic elements for complex digital designs.
- Embedded Memory Approximately 6.64 Mbits of on-chip RAM (6,635,520 bits) to support data buffering, FIFOs, and local storage.
- I/O Resources 270 general-purpose I/O pins to interface with peripherals, sensors, and external memory devices.
- Power Core voltage supply range of 1.16 V to 1.24 V, enabling defined power provisioning for the FPGA core.
- Package & Mounting 484-FBGA (23×23) package in a surface-mount form factor for space-efficient board integration.
- Temperature & Grade Commercial-grade device rated for operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: 149,760 logic elements provide large capacity for complex FPGA implementations and parallel processing tasks.
- Substantial on-chip memory: Approximately 6.64 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
- Ample I/O count: 270 I/Os deliver flexible connectivity for multi-interface designs and system integration.
- Compact surface-mount package: 484-FBGA (23×23) enables a small PCB footprint while supporting high pin-count routing.
- Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard consumer and industrial-adjacent electronic products.
- RoHS compliant: Conforms to common lead-free manufacturing requirements.
Why Choose EP4CGX150CF23C7?
The EP4CGX150CF23C7 offers a balance of high logic capacity, significant embedded memory, and extensive I/O in a compact 484-FBGA surface-mount package. As part of Intel’s Cyclone IV GX family, it is suited to commercial electronic designs that require substantial programmable logic resources and on-chip RAM while maintaining a modest board footprint.
Designers and procurement teams who need a commercial-grade FPGA with defined supply and temperature ranges will find this device appropriate for applications that demand large FPGA fabrics, extensive I/O, and RoHS compliance.
Request a quote or submit a pricing inquiry for EP4CGX150CF23C7 to receive availability and ordering information.

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