EP4CGX150CF23C8

IC FPGA 270 I/O 484FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 270 6635520 149760 484-BGA

Quantity 636 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O270Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9360Number of Logic Elements/Cells149760
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6635520

Overview of EP4CGX150CF23C8 – Cyclone® IV GX FPGA, 149,760 logic elements, 484-BGA

The EP4CGX150CF23C8 is a Cyclone® IV GX field programmable gate array (FPGA) IC designed for commercial-grade programmable logic implementations. It integrates 149,760 logic elements and approximately 6.64 Mbits of embedded memory to support complex custom logic and on-chip buffering in space-efficient packages.

With 270 general-purpose I/O and a specified supply voltage range of 1.16 V to 1.24 V, this device is intended for commercial systems that require substantial logic capacity and embedded RAM in a surface-mount 484-BGA package.

Key Features

  • Logic Capacity  149,760 logic elements for implementing complex digital logic and parallel datapaths.
  • Embedded Memory  Approximately 6.64 Mbits (6,635,520 bits) of on-chip RAM for buffering, lookup tables, and state storage.
  • I/O  270 I/O pins to support multiple external interfaces and board-level connectivity.
  • Power  Specified core voltage supply range of 1.16 V to 1.24 V for predictable power budgeting and design integration.
  • Package & Mounting  484-BGA (484-FBGA, 23×23) surface-mount package that balances pin count and board area for dense designs.
  • Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Custom Logic Acceleration  Implement hardware-accelerated functions and data-paths using the device's large logic and memory resources.
  • Embedded System Integration  Integrate protocol bridging, glue logic, and custom peripherals where substantial I/O and on-chip RAM are required.
  • Prototyping and Development  Use the FPGA’s programmable fabric to validate architectures and iterate on digital designs during development cycles.

Unique Advantages

  • High Logic Density: 149,760 logic elements enable implementation of complex designs without external programmable logic.
  • Significant On-Chip Memory: Approximately 6.64 Mbits of embedded RAM reduces dependence on off-chip memory for buffering and state retention.
  • Generous I/O Count: 270 I/O pins support multiple interfaces and board-level integration options.
  • Compact BGA Package: 484-FBGA (23×23) surface-mount packaging provides a high pin count in a compact footprint for space-constrained designs.
  • Commercial-Grade Operation: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.

Why Choose EP4CGX150CF23C8?

EP4CGX150CF23C8 positions itself as a commercially graded Cyclone® IV GX FPGA that combines substantial logic resources, on-chip memory, and a high I/O count in a compact 484-BGA package. Its defined supply voltage range and operating temperature make it suitable for a broad range of commercial electronic systems where predictable integration and board-level density matter.

This device is well suited for designers and engineering teams who need a programmable, high-capacity logic solution with embedded RAM and wide I/O availability, providing a scalable platform for prototyping and production of commercial applications.

Request a quote or submit an inquiry to the sales team for pricing, lead time, and availability of EP4CGX150CF23C8.

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