EP4CGX150CF23I7

The EP4CGX150CF23I7 is an Intel Cyclone® IV GX Field Programmable Gate Array (FPGA) delivered in a 484-BGA package. It provides a high logic capacity FPGA fabric with significant on-chip RAM and a substantial I/O count, offered in an industrial-grade device rated for extended temperature operation.

This device is suitable for board-level integration where compact packaging, high-density logic, and robust temperature capability are required. Key electrical and mechanical attributes include a 484-FBGA (23×23) package, a core voltage range of 1.16 V to 1.24 V, and operation from -40 °C to 100 °C.

Key Features

• Core Logic  149,760 logic elements provide a large FPGA fabric for complex digital designs.
• Embedded Memory  Approximately 6.64 Mbits of on-chip RAM (6,635,520 bits) for buffering, state storage, and local data processing.
• I/O Density  Up to 270 user I/O pins to support diverse external interfaces and parallel connectivity.
• Package  484-FBGA (23×23) BGA package (484-ball) for high-density board integration.
• Power  Core supply voltage specified from 1.16 V to 1.24 V to match system power-rail design constraints.
• Temperature and Grade  Industrial-grade device qualified for operation from -40 °C to 100 °C for deployment in demanding environments.
• Mounting  Surface-mount package suitable for automated PCB assembly.
• RoHS Compliant  Conforms to RoHS environmental requirements.

Typical Applications

• High-density digital designs  Implement systems requiring up to 149,760 logic elements and substantial embedded RAM within a single FPGA.
• I/O-intensive systems  Use where up to 270 I/O pins are needed for external interfaces and parallel signal routing.
• Industrial systems  Deploy in applications that require industrial-grade components and operation across -40 °C to 100 °C.
• Compact board-level integration  Integrate into space-constrained PCBs using the 484-FBGA (23×23) surface-mount package.

Unique Advantages

• High logic capacity: 149,760 logic elements enable implementation of complex architectures without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 6.64 Mbits of embedded RAM reduces external memory requirements and simplifies board design.
• Generous I/O count: 270 I/O pins support a wide range of external connections and parallel data paths.
• Industrial temperature range: Rated from -40 °C to 100 °C for reliable operation in harsh environments.
• Compact BGA package: 484-FBGA (23×23) balances pin count and board space for dense system implementations.
• Controlled core voltage: 1.16 V to 1.24 V supply range simplifies power-rail planning for system designers.

Why Choose EP4CGX150CF23I7?

The EP4CGX150CF23I7 combines a high count of logic elements, significant embedded RAM, and a large I/O complement in a compact 484-FBGA package, all in an industrial-grade FPGA. These characteristics make it well suited for engineers designing high-density digital systems that require robust temperature performance and board-level integration.

Choosing this device provides a consistent, verifiable set of capabilities—logic density, on-chip memory, I/O capacity, package footprint, and an industrial operating range—helping to reduce system complexity and support long-term deployment in demanding environments.

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