EP4CGX150DF27C7N

The EP4CGX150DF27C7N is a Cyclone® IV GX commercial-grade FPGA delivering dense programmable logic, on-chip memory and a large I/O complement in a 672-BGA package. The device provides 149,760 logic elements, approximately 6.64 Mbits of embedded memory and 393 I/O pins, enabling complex custom logic and system integration for commercial electronic designs.

With a 1.16–1.24 V core supply range, surface-mount 672-FBGA (27 × 27) package and RoHS compliance, this FPGA targets designers who need high-density programmable resources and a single-device solution for consolidating multiple functions in commercial applications.

Key Features

• Logic Capacity – 149,760 logic elements for implementing high-density custom logic, state machines and parallel processing pipelines.
• Embedded Memory – Approximately 6.64 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
• I/O Resources – 393 I/O pins to support extensive peripheral connectivity and board-level interfacing.
• Power and Voltage – Core voltage supply range of 1.16 V to 1.24 V to match system power rails and enable consistent operation within specified limits.
• Package and Mounting – 672-BGA package (supplier package: 672-FBGA 27×27) designed for surface-mount assembly and compact board integration.
• Operating Range and Grade – Commercial grade with an operating temperature range of 0 °C to 85 °C, suitable for standard commercial environments.
• Regulatory Compliance – RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Custom Programmable Logic – Implement application-specific datapaths, controllers and protocol processing using the device's 149,760 logic elements and on-chip RAM.
• High-Density I/O Control – Use the 393 I/O pins to manage multiple sensors, interfaces or board-level peripherals in commercial electronic systems.
• Embedded System Integration – Consolidate multiple discrete functions into a single FPGA to simplify BOM and board routing in commercial products.

Unique Advantages

• High Logic Density: 149,760 logic elements allow implementation of complex designs without immediate need for multiple devices.
• Significant On-Chip Memory: Approximately 6.64 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage.
• Extensive I/O Count: 393 I/O pins provide flexibility to connect many peripherals and interfaces directly to the FPGA.
• Compact BGA Package: 672-FBGA (27×27) enables high-density board layouts and surface-mount assembly for space-constrained designs.
• Commercial-Grade Specification: 0 °C to 85 °C operating range and RoHS compliance align with standard commercial production requirements.
• Controlled Core Supply: 1.16–1.24 V voltage range supports predictable core power delivery and design planning.

Why Choose EP4CGX150DF27C7N?

The EP4CGX150DF27C7N positions itself as a high-density, commercially rated FPGA option for designers needing substantial programmable logic, on-chip memory and a large number of I/Os in a single package. Its combination of 149,760 logic elements, approximately 6.64 Mbits of embedded RAM and 393 I/Os supports consolidation of complex functions and system-level integration.

This device is suited for commercial embedded designs where integration, board space efficiency and regulatory compliance are priorities. Its package, voltage range and operating temperature provide a practical platform for developers aiming to scale functionality while managing BOM and board-level complexity.

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