EP4CGX150DF27I7N

The EP4CGX150DF27I7N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel, delivering a large programmable logic fabric with 149,760 logic elements, approximately 6.6 Mbits of embedded memory, and 393 user I/O signals. Packaged in a 672-BGA (672-FBGA, 27×27) surface-mount package, it targets designs that require dense logic resources and substantial I/O capacity.

Specified for industrial use, the device operates from a 1.16 V to 1.24 V supply and across a temperature range of −40 °C to 100 °C, and is RoHS compliant.

Key Features

• Core Logic 149,760 logic elements provide a large programmable fabric for complex digital designs.
• Embedded Memory Approximately 6.6 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage directly within the FPGA.
• I/O Capacity 393 user I/O pins to support multi-channel interfacing and parallel connectivity requirements.
• Power Supply Operates with a supply voltage range of 1.16 V to 1.24 V to match system power requirements.
• Package & Mounting 672-BGA (672-FBGA, 27×27) surface-mount package for high pin density in a compact form factor.
• Temperature & Grade Industrial grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control Programmable logic and abundant I/O make this FPGA suitable for control systems, sensor aggregation, and industrial automation modules operating across wide temperature ranges.
• High-density Digital Processing Large logic capacity and embedded memory support complex data-paths and parallel processing tasks in custom digital designs.
• I/O-intensive Interfaces With 393 I/O signals, the device supports multi-channel data acquisition, bridging, and protocol interfacing within compact PCB layouts.
• Prototyping and Custom Hardware Dense logic and on-chip memory enable development of proprietary accelerators and hardware prototypes that require significant programmable resources.

Unique Advantages

• High Logic Capacity: 149,760 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial On-chip Memory: Approximately 6.6 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 393 user I/Os provide flexible interfacing options for parallel and multi-protocol systems.
• Industrial-rated Operation: −40 °C to 100 °C operating range and industrial grade designation support deployment in challenging environments.
• Compact High-density Package: The 672-FBGA (27×27) surface-mount package delivers many I/Os and logic in a space-efficient footprint.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose EP4CGX150DF27I7N?

The EP4CGX150DF27I7N offers a balanced combination of large logic capacity, significant on-chip memory, and a high count of user I/O in a compact 672-BGA package. Its industrial temperature rating and defined supply range make it appropriate for designs that require robust operation across extended environmental conditions.

This device is suited to engineers and system designers building complex, I/O-rich programmable hardware—especially where on-chip memory and logic density reduce the need for external components and simplify board-level integration.

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