EP4CGX150DF31C7N

The EP4CGX150DF31C7N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) in a 896‑BGA package, designed for high‑density digital logic implementations. With 149,760 logic elements, abundant on‑chip RAM and a large I/O count, it targets applications that require substantial programmable logic, embedded memory and extensive interfacing in a compact surface‑mount package.

Key Features

• Core Logic 149,760 logic elements to implement complex, high‑density digital designs.
• Embedded Memory Approximately 6.64 Mbits of on‑chip RAM for buffering, state storage and data processing tasks.
• I/O Capacity 475 user I/O pins to support broad interfacing needs and multiple external devices.
• Power Core supply voltage range from 1.16 V to 1.24 V to match system power designs and enable predictable supply planning.
• Package & Mounting 896‑BGA (896‑FBGA, 31×31) surface‑mount package for dense board integration and reliable soldered connections.
• Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for mainstream embedded and communication products.
• Compliance RoHS compliant for environmental regulatory requirements.

Typical Applications

• Custom Digital Logic — Implement high‑density, application‑specific logic using the FPGA’s 149,760 logic elements and on‑chip memory.
• High‑I/O Interfaces — Use the 475 I/O pins to aggregate, translate or route multiple peripheral and high‑speed interfaces.
• Embedded Processing & Buffering — Leverage approximately 6.64 Mbits of embedded RAM for buffering, packet processing or temporary data storage.

Unique Advantages

• High Logic Capacity: 149,760 logic elements enable implementation of large, integrated digital functions without external ASICs.
• Significant On‑Chip Memory: Approximately 6.64 Mbits of RAM reduces dependency on external memory for many buffering and state‑holding needs.
• Extensive I/O Count: 475 I/Os simplify system integration when multiple peripherals or parallel interfaces are required.
• Compact BGA Packaging: 896‑FBGA (31×31) allows dense PCB layouts while maintaining robust solder connections for production assemblies.
• Commercial‑Grade Reliability: 0 °C to 85 °C operating range and RoHS compliance align with mainstream product and regulatory expectations.

Why Choose EP4CGX150DF31C7N?

The EP4CGX150DF31C7N positions itself as a high‑capacity Cyclone® IV GX FPGA option for designs that need a large number of logic elements, substantial embedded memory and broad I/O connectivity in a single surface‑mount BGA package. Its specified core voltage range and commercial operating temperature make it suitable for mainstream embedded, communications and digital processing designs.

For development teams and procurement engineers seeking a scalable, densely packed programmable logic device with verifiable on‑chip resources, this device offers a balance of integration and board‑level efficiency while meeting RoHS environmental requirements.

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