EP4CGX150DF27I7

The EP4CGX150DF27I7 is a Cyclone® IV GX FPGA from Intel, delivering high logic density and substantial on-chip memory in a compact BGA package. Designed for industrial-grade applications, it provides a combination of logic resources, embedded RAM, and abundant I/O suitable for programmable-logic implementations that require robust operating-temperature range and surface-mount packaging.

Key Features

• FPGA Core Cyclone® IV GX architecture in a field-programmable gate array IC.
• Logic Capacity 149,760 logic elements for implementing complex digital designs and custom logic.
• Embedded Memory Approximately 6.64 Mbits of on-chip RAM (6,635,520 total RAM bits) to support buffering, LUTs, and local data storage.
• I/O Count 393 I/O pins to support wide interfacing and multi-channel connectivity.
• Power Core voltage supply range of 1.16 V to 1.24 V for the device core.
• Package and Mounting 672-ball BGA (672-FBGA, 27×27) package in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Compliance RoHS-compliant material status.

Typical Applications

• Industrial Control and Automation — High logic density and industrial temperature rating enable deployment in control systems and automation equipment requiring reliable programmable logic.
• Communications and I/O Aggregation — Large I/O count supports multi-channel interfaces, protocol bridging, and board-level I/O consolidation.
• Embedded Logic and Data Buffering — Significant on-chip RAM allows for local data buffering and custom data-path implementations within embedded systems.
• Production and Ruggedized Systems — Surface-mount 672-FBGA package and industrial grade make the device suitable for compact, production-level assemblies operating in demanding environments.

Unique Advantages

• High Logic Density: 149,760 logic elements enable complex designs without immediate migration to larger families, reducing board-level complexity.
• Substantial On-Chip Memory: Approximately 6.64 Mbits of embedded RAM supports data buffering and local processing, minimizing external memory needs.
• Extensive I/O Capability: 393 I/O pins provide flexibility for multi-signal interfaces and parallel connectivity options.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for environments that require extended temperature performance.
• Compact Surface-Mount Package: 672-FBGA (27×27) package supports density-optimized PCB layouts for space-constrained designs.
• Controlled Core Voltage Range: 1.16–1.24 V supply requirement enables predictable power planning for system designs.

Why Choose EP4CGX150DF27I7?

The EP4CGX150DF27I7 provides a balanced combination of logic capacity, embedded memory, and I/O density in an industrial-grade Cyclone® IV GX FPGA. Its specifications make it well suited for design teams building production systems that require substantial programmable logic resources, on-chip RAM, and a broad operating-temperature window.

Engineers seeking a compact, surface-mount FPGA solution with verified RoHS compliance and a defined core voltage range will find this device appropriate for a range of industrial and embedded applications where integration density and thermal tolerance are important.

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