EP4CGX150DF27C8

The EP4CGX150DF27C8 is a Cyclone® IV GX field programmable gate array from Intel designed for high-density, on-chip logic integration. It provides 149,760 logic elements, approximately 6.64 Mbits of embedded memory, and 393 I/O pins in a 672-BGA package for compact, surface-mount system designs.

This commercial-grade FPGA targets designs that require significant logic capacity and on-chip memory while operating at a core voltage range of 1.16 V to 1.24 V and within a 0 °C to 85 °C temperature window.

Key Features

• Core Logic  149,760 logic elements provide substantial programmable logic capacity for complex digital functions and parallel processing.
• Embedded Memory  Approximately 6.64 Mbits of on-chip RAM to support data buffering, frame storage, and intermediate processing without external memory.
• I/O Density  393 I/O pins enable broad connectivity to peripherals, interfaces, and system-level signals.
• Package & Mounting  672-BGA (supplier package: 672-FBGA, 27×27) in a surface-mount form factor for space-constrained board layouts.
• Power  Core supply voltage specified from 1.16 V to 1.24 V to align with system power budgeting and regulator design.
• Operating Range  Commercial temperature rating from 0 °C to 85 °C suitable for typical commercial and lab environments.
• Compliance  RoHS compliant for regulatory alignment in standard manufacturing flows.

Typical Applications

• Embedded Systems  Implement custom control logic, protocol handling, and system orchestration where high logic density and on-chip memory reduce external components.
• Communications Equipment  Use the device for protocol processing, packet handling, and interface aggregation leveraging large logic and I/O resources.
• Signal and Data Processing  Deploy for parallel processing tasks, buffering, and intermediate data storage using the embedded RAM and abundant logic elements.
• Prototyping and Evaluation  Suitable for development platforms and proof-of-concept designs that require significant programmable resources in a compact package.

Unique Advantages

• High logic capacity: 149,760 logic elements reduce the need for multiple FPGAs or external glue logic in complex designs.
• On-chip memory availability: Approximately 6.64 Mbits of embedded RAM lowers dependence on external memory for many buffering and storage tasks.
• Robust I/O count: 393 I/Os provide broad connectivity options for multi-interface designs and high-pin-count peripherals.
• Compact SMT package: 672-BGA (27×27) enables dense board layouts while maintaining a high pin count for system integration.
• Regulatory readiness: RoHS compliance supports standard manufacturing and environmental requirements.

Why Choose EP4CGX150DF27C8?

The EP4CGX150DF27C8 positions itself as a high-density, commercially rated Cyclone IV GX FPGA suitable for engineers who need substantial on-chip logic and memory in a single surface-mount package. With a large number of I/Os and a defined core voltage range, it fits designs where integration and compact board footprint are priorities.

Manufactured by Intel, this device is a practical choice for teams developing complex embedded, communications, or data-processing systems that benefit from significant programmable resources and on-board RAM while operating within commercial temperature limits.

Request a quote or submit a procurement inquiry to get pricing and availability for EP4CGX150DF27C8. Our team can provide lead-time information and support material to help you move from evaluation to production.