EP4CGX150DF27C8N

The EP4CGX150DF27C8N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 672-ball BGA package. It provides substantial on-chip logic and embedded memory complemented by a high I/O count for complex digital designs.

This commercial‑grade, surface‑mount FPGA operates from a 1.16 V to 1.24 V supply and across a 0 °C to 85 °C temperature range, and it is RoHS compliant.

Key Features

• Logic Capacity  149,760 logic elements to support high-density digital logic integration and complex design implementation.
• Embedded Memory  Approximately 6.64 Mbits of embedded memory for on-chip data buffering and intermediate storage.
• I/O Resources  393 I/O pins to accommodate broad peripheral and interface connectivity requirements.
• Power  Supported core voltage range from 1.16 V to 1.24 V for system power planning.
• Package & Mounting  672‑FBGA (27×27) package in a surface‑mount form factor for compact board integration.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet common environmental and regulatory program requirements.

Typical Applications

• Prototyping and Development  Use the FPGA’s large logic resource and on‑chip memory to prototype digital designs and validate system architectures.
• High‑Density Digital Systems  Deploy where large numbers of logic elements and numerous I/Os are required to implement complex custom logic and interface aggregation.
• Embedded Processing and Acceleration  Leverage the combination of logic capacity and embedded memory for hardware acceleration and data‑path implementations within commercial applications.

Unique Advantages

• High logic density: 149,760 logic elements enable implementation of extensive custom logic and parallel processing structures.
• Substantial on‑chip memory: Approximately 6.64 Mbits of embedded memory reduces dependency on external RAM for many buffering and storage tasks.
• Extensive I/O count: 393 I/Os support a wide range of interfaces and peripherals on a single device, simplifying board-level design.
• Compact BGA package: 672‑FBGA (27×27) provides a dense footprint for space-constrained PCBs while supporting surface-mount assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial applications and environments.
• Regulatory readiness: RoHS compliance supports customer environmental requirements and supply‑chain compliance.

Why Choose EP4CGX150DF27C8N?

The EP4CGX150DF27C8N positions itself as a high‑capacity Cyclone® IV GX FPGA suited for designers who need large programmable logic resources, significant embedded memory, and abundant I/O in a compact BGA package. Its commercial grade and RoHS compliance make it appropriate for a broad range of commercial electronic products.

This device is a fit for teams building complex digital systems that require on‑chip integration to reduce board-level complexity and streamline system architecture. With its combination of logic density, embedded memory, and I/O resources, it offers scalability and integration potential for evolving designs.

Request a quote or submit your requirements today to get pricing and availability for the EP4CGX150DF27C8N.