EP4CGX150DF27C7

IC FPGA 393 I/O 672FBGA
Part Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 393 6635520 149760 672-BGA

Quantity 798 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O393Voltage1.16 V - 1.24 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9360Number of Logic Elements/Cells149760
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6635520

Overview of EP4CGX150DF27C7 – Cyclone® IV GX FPGA, 149,760 logic elements, 672‑BGA

The EP4CGX150DF27C7 is an Intel Cyclone® IV GX field-programmable gate array (FPGA) offered in a 672-BGA package. The device provides a large on-chip logic capacity and embedded RAM suitable for complex programmable logic designs where compact packaging and a defined commercial operating range are required.

Key device attributes include 149,760 logic elements, approximately 6.64 Mbits of embedded memory, 393 I/O pins, a 672‑FBGA (27×27) package, and a core supply voltage range of 1.16 V to 1.24 V. The device is RoHS compliant and rated for commercial operation from 0 °C to 85 °C.

Key Features

  • Core Logic 149,760 logic elements provide high-capacity programmable logic resources for implementing complex digital functions.
  • Embedded Memory Approximately 6.64 Mbits of on-chip RAM (total RAM bits: 6,635,520) for frame buffers, FIFOs, and internal data storage.
  • I/O Density 393 I/O pins support wide connectivity for system-level interfacing and peripheral integration.
  • Package & Mounting 672‑BGA (supplier package: 672‑FBGA, 27×27) in a surface-mount form factor to support space-constrained board layouts.
  • Power Core voltage supply range of 1.16 V to 1.24 V for integration into regulated power domains.
  • Temperature & Grade Commercial-grade device specified for operation from 0 °C to 85 °C.
  • Compliance RoHS compliant for adherence to common environmental standards.

Unique Advantages

  • High logic capacity: 149,760 logic elements enable large-scale designs without partitioning across multiple devices.
  • Significant on-chip memory: Approximately 6.64 Mbits of embedded RAM reduces the need for external memory in many buffering and storage tasks.
  • Robust I/O count: 393 I/O pins allow broad peripheral and system connectivity within a single package.
  • Compact BGA footprint: The 672‑FBGA (27×27) package balances high pin count with a compact PCB footprint for dense system integration.
  • Commercial temperature range: Specified operation from 0 °C to 85 °C for typical commercial applications and environments.
  • Manufacturer pedigree: Designed and produced by Intel, providing consistency with established FPGA product families.

Why Choose EP4CGX150DF27C7?

The EP4CGX150DF27C7 positions itself as a high-capacity Cyclone IV GX FPGA option for designs that require substantial programmable logic and embedded memory within a compact BGA package. Its combination of 149,760 logic elements, roughly 6.64 Mbits of on-chip RAM, and 393 I/Os makes it suitable for complex digital implementations where board space and I/O density are important.

With a defined commercial temperature range, a narrow core voltage window for power-domain planning, and RoHS compliance, this Intel-sourced FPGA delivers verifiable hardware characteristics for procurement and system design. It is well suited to teams seeking a large, single-chip programmable solution supported by an established FPGA family.

Request a quote or submit a product inquiry to obtain pricing and availability for the EP4CGX150DF27C7.

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