EP4CGX150DF27C7
| Part Description |
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 393 6635520 149760 672-BGA |
|---|---|
| Quantity | 798 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 393 | Voltage | 1.16 V - 1.24 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9360 | Number of Logic Elements/Cells | 149760 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6635520 |
Overview of EP4CGX150DF27C7 – Cyclone® IV GX FPGA, 149,760 logic elements, 672‑BGA
The EP4CGX150DF27C7 is an Intel Cyclone® IV GX field-programmable gate array (FPGA) offered in a 672-BGA package. The device provides a large on-chip logic capacity and embedded RAM suitable for complex programmable logic designs where compact packaging and a defined commercial operating range are required.
Key device attributes include 149,760 logic elements, approximately 6.64 Mbits of embedded memory, 393 I/O pins, a 672‑FBGA (27×27) package, and a core supply voltage range of 1.16 V to 1.24 V. The device is RoHS compliant and rated for commercial operation from 0 °C to 85 °C.
Key Features
- Core Logic 149,760 logic elements provide high-capacity programmable logic resources for implementing complex digital functions.
- Embedded Memory Approximately 6.64 Mbits of on-chip RAM (total RAM bits: 6,635,520) for frame buffers, FIFOs, and internal data storage.
- I/O Density 393 I/O pins support wide connectivity for system-level interfacing and peripheral integration.
- Package & Mounting 672‑BGA (supplier package: 672‑FBGA, 27×27) in a surface-mount form factor to support space-constrained board layouts.
- Power Core voltage supply range of 1.16 V to 1.24 V for integration into regulated power domains.
- Temperature & Grade Commercial-grade device specified for operation from 0 °C to 85 °C.
- Compliance RoHS compliant for adherence to common environmental standards.
Unique Advantages
- High logic capacity: 149,760 logic elements enable large-scale designs without partitioning across multiple devices.
- Significant on-chip memory: Approximately 6.64 Mbits of embedded RAM reduces the need for external memory in many buffering and storage tasks.
- Robust I/O count: 393 I/O pins allow broad peripheral and system connectivity within a single package.
- Compact BGA footprint: The 672‑FBGA (27×27) package balances high pin count with a compact PCB footprint for dense system integration.
- Commercial temperature range: Specified operation from 0 °C to 85 °C for typical commercial applications and environments.
- Manufacturer pedigree: Designed and produced by Intel, providing consistency with established FPGA product families.
Why Choose EP4CGX150DF27C7?
The EP4CGX150DF27C7 positions itself as a high-capacity Cyclone IV GX FPGA option for designs that require substantial programmable logic and embedded memory within a compact BGA package. Its combination of 149,760 logic elements, roughly 6.64 Mbits of on-chip RAM, and 393 I/Os makes it suitable for complex digital implementations where board space and I/O density are important.
With a defined commercial temperature range, a narrow core voltage window for power-domain planning, and RoHS compliance, this Intel-sourced FPGA delivers verifiable hardware characteristics for procurement and system design. It is well suited to teams seeking a large, single-chip programmable solution supported by an established FPGA family.
Request a quote or submit a product inquiry to obtain pricing and availability for the EP4CGX150DF27C7.

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