EP4CGX150CF23C8N

The EP4CGX150CF23C8N is a Cyclone® IV GX Field Programmable Gate Array (FPGA) in a 484-BGA package designed for commercial applications. It provides a high-density programmable fabric with 149,760 logic elements and approximately 6.6 Mbits of embedded memory, plus 270 user I/Os for flexible system interfacing.

With a compact 484-FBGA (23×23) footprint, surface-mount mounting, and a 1.16 V–1.24 V core supply range, this device addresses designs that require significant logic capacity, on-chip RAM, and a substantial number of I/O signals within a commercial temperature range of 0 °C to 85 °C.

Key Features

• High-density logic — 149,760 logic elements to implement complex digital functions and custom hardware acceleration.
• Embedded memory — Approximately 6.6 Mbits of on-chip RAM for buffering, lookup tables, and state storage close to logic.
• Extensive I/O — 270 user I/O pins to support broad connectivity requirements and interface multiple peripherals or buses.
• Package and mounting — 484-BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for dense board integration.
• Power supply — Core voltage supply specified from 1.16 V to 1.24 V for predictable power planning.
• Commercial temperature rating — Rated for operation from 0 °C to 85 °C for standard commercial deployments.
• Regulatory/environmental — RoHS compliant to support lead-free production processes.

Typical Applications

• High-performance logic integration — Implement custom datapaths, protocol bridges, or hardware accelerators where large logic capacity and embedded RAM are required.
• Multi-I/O interface hubs — Aggregate and translate signals between multiple peripherals or subsystems using the device’s 270 I/Os.
• Prototyping and development — Deploy as a development platform for complex digital designs that need significant on-chip resources within a commercial environment.

Unique Advantages

• Large programmable fabric: 149,760 logic elements enable implementation of extensive custom logic, reducing the need for external ASICs or multiple discrete ICs.
• Substantial on‑chip memory: Approximately 6.6 Mbits of embedded RAM minimizes external memory requirements and lowers system-level latency.
• Ample I/O capacity: 270 I/Os provide design flexibility for routing multiple interfaces without additional multiplexing circuitry.
• Compact, board-friendly package: 484-FBGA (23×23) surface-mount package supports high-density PCB layouts while maintaining robust signal routing options.
• Predictable power envelope: Defined 1.16 V–1.24 V supply range simplifies power-supply design and thermal planning.
• RoHS compliant: Supports lead-free manufacturing flows and environmental regulatory requirements.

Why Choose EP4CGX150CF23C8N?

The EP4CGX150CF23C8N combines a high logic-element count, substantial embedded memory, and a large complement of I/Os in a compact 484-BGA package, making it well suited for commercial designs that demand significant on-chip resources and flexible interfacing. Its defined voltage range and commercial temperature rating enable predictable integration into standard product platforms.

This device is a strong option for engineering teams building complex digital systems, prototypes, or mid-volume commercial products that benefit from on-chip memory, abundant logic capacity, and extensive I/O without moving to larger package footprints.

Request a quote or submit an inquiry to discuss pricing, availability, and procurement for the EP4CGX150CF23C8N.