EP4CGX110DF31I7N

The EP4CGX110DF31I7N is an Intel Cyclone IV GX FPGA in an 896-ball BGA package designed for industrial applications. It provides a large programmable fabric with 109,424 logic elements, approximately 5.62 Mbits of embedded memory and 475 I/O pins to support complex, I/O‑dense designs within a surface-mount footprint.

Key Features

• Logic Capacity — 109,424 logic elements provide substantial on-chip programmable logic for implementing custom state machines, datapaths and control logic.
• Embedded Memory — Approximately 5.62 Mbits of on-chip RAM for FIFOs, buffers and distributed storage close to logic blocks.
• I/O Density — 475 user I/O pins enable wide parallel interfaces, multiple serial links or mixed-signal front-end connections.
• Package & Mounting — 896-ball BGA (896-FBGA, 31×31) optimized for surface-mount assembly and compact board layouts.
• Power Supply — Core supply range of 1.16 V to 1.24 V to match system power rails and regulator designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance — RoHS compliant for lead‑free assembly and regulatory conformity.

Typical Applications

• Industrial Control Systems — Implement custom motor control, PLC logic and deterministic timing functions using abundant logic elements and I/O.
• Communications & Networking — Support parallel and high-density I/O interfaces for aggregation, protocol bridging or custom packet processing.
• Embedded Processing & Acceleration — Offload specialized datapath tasks and hardware-accelerated functions using on-chip memory and programmable logic.

Unique Advantages

• High Logic Density: 109,424 logic elements allow implementation of large, integrated designs without immediate need for multiple devices.
• Substantial On‑Chip Memory: Approximately 5.62 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Large I/O Count: 475 I/O pins simplify board-level interfacing and reduce the need for external multiplexing or I/O expanders.
• Industrial‑Grade Operation: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact Assembly: 896‑ball BGA (31×31) enables compact PCB layouts with a surface-mount form factor suited to modern board designs.

Why Choose EP4CGX110DF31I7N?

The EP4CGX110DF31I7N combines large programmable capacity, significant embedded memory and extensive I/O in a single industrial‑rated FPGA package. It suits designers who need a balance of logic resources, on‑chip RAM and high I/O count for mid-to-large complexity embedded systems deployed in industrial environments.

With a defined core voltage range and RoHS compliance, this device fits designs that require predictable power integration and compliant manufacturing practices while offering the scalability and integration typical of Intel Cyclone IV GX devices.

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