EP4CGX110DF31C8N

The EP4CGX110DF31C8N is a Cyclone® IV GX field‑programmable gate array (FPGA) from Intel, delivered in an 896‑ball BGA package. It offers a high density of programmable logic, substantial on‑chip RAM, and a large number of I/O for designs that require extensive digital integration.

Tightly tied to its specifications, this device targets designs that need large logic capacity (109,424 logic elements), significant embedded memory (approximately 5.62 Mbits), and up to 475 general‑purpose I/O pins while operating in a commercial temperature range.

Key Features

• Core Logic  109,424 logic elements provide high-density programmable logic resources for complex digital implementations.
• Embedded Memory  Approximately 5.62 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage.
• I/O Capacity  475 user I/O pins suitable for multi‑port interfaces, parallel buses, and extensive sensor/board connectivity.
• Power Supply  Operates with a supply range of 1.16 V to 1.24 V to match system power budgeting and core requirements.
• Package Options  Supplied in an 896‑BGA package (896‑FBGA, 31×31) for high‑density mounting and board integration.
• Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant for adherence to common environmental directives.

Typical Applications

• High‑density programmable logic  Implement large, custom digital functions using the 109,424 logic elements.
• High‑I/O interface control  Manage multiple parallel interfaces or large connector arrays using up to 475 I/O pins.
• Embedded memory‑dependent designs  Use approximately 5.62 Mbits of on‑chip RAM for buffering, look‑up tables, and temporary data storage.
• Compact board integration  The 896‑FBGA (31×31) package supports dense PCB layouts and system miniaturization.

Unique Advantages

• High logic density: 109,424 logic elements enable integration of complex functions into a single device, reducing component count.
• Substantial on‑chip RAM: Approximately 5.62 Mbits of embedded memory supports localized data handling and reduces external memory dependence.
• Extensive I/O: 475 I/O pins allow direct interfacing to numerous peripherals, sensors, and parallel buses without multiplexing.
• Board‑level integration: 896‑FBGA (31×31) packaging provides a compact footprint for space‑constrained systems.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C aligns with a wide range of consumer and industrial electronic applications.
• Regulatory readiness: RoHS compliance simplifies environmental qualification for many markets.

Why Choose EP4CGX110DF31C8N?

The EP4CGX110DF31C8N positions itself as a high‑capacity, commercial‑grade Cyclone IV GX FPGA from Intel, offering a blend of large logic resources, meaningful embedded memory, and broad I/O in an industry‑standard BGA package. Its specification set makes it suitable for designs that require consolidation of complex digital functionality, extensive interfacing, and on‑chip data storage while operating within a commercial temperature range.

For engineers and designers looking to reduce board count and integrate substantial programmable logic into compact system architectures, this device provides predictable electrical and thermal boundaries—backed by a recognized FPGA family—while remaining compliant with RoHS requirements.

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