EP4CGX110DF31I7

The EP4CGX110DF31I7 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) from Intel, supplied in an 896‑FBGA (31×31) package. It is specified for industrial-grade applications and combines high logic capacity with on‑chip memory and extensive I/O in a compact surface‑mount package.

Key measurable attributes include 109,424 logic elements, approximately 5.62 Mbits of embedded memory, 475 I/Os, a core supply range of 1.16 V to 1.24 V, and an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core Logic: 109,424 logic elements to support complex, large-scale logic implementations.
• Embedded Memory: Approximately 5.62 Mbits of on‑chip RAM for data buffering, state storage, and lookup tables.
• I/O Resources: 475 I/Os providing broad external connectivity options for peripherals and interfaces.
• Power Supply: Core voltage specified at 1.16 V to 1.24 V to match system power rails and design requirements.
• Package & Mounting: 896‑FBGA (31×31) package, surface‑mount, suited for high‑density PCB layouts.
• Temperature & Grade: Industrial grade device with an operating range of −40 °C to 100 °C for demanding environments.
• Environmental Compliance: RoHS compliant to meet regulatory and manufacturing requirements.

Unique Advantages

• Large programmable fabric: 109,424 logic elements enable implementation of complex algorithms and parallel processing.
• Significant on‑chip memory: Approximately 5.62 Mbits of embedded RAM reduces reliance on external memory for many designs.
• Extensive pinout: 475 I/Os provide flexibility for interfacing with multiple peripherals and high‑pin‑count systems.
• Industrial operating range: Rated from −40 °C to 100 °C to support harsher thermal environments.
• Compact BGA footprint: 896‑FBGA (31×31) supports high‑density system integration and surface‑mount assembly.
• Manufacturer pedigree: Supplied by Intel, consistent with industry documentation and product support resources.

Why Choose EP4CGX110DF31I7?

EP4CGX110DF31I7 positions itself as an industrial‑grade FPGA option combining a high count of logic elements, a substantial amount of embedded memory, and a large I/O complement in a compact 896‑FBGA package. These measurable capabilities make it suitable for engineers seeking a scalable programmable fabric with on‑chip resources and robust thermal range.

The device's specifications — including the core voltage range and RoHS compliance — provide clear, verifiable design parameters for procurement and system integration. Backed by Intel, the part aligns with published series documentation for designers who require quantifiable platform characteristics.

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