EP4CGX150CF23I7N

The EP4CGX150CF23I7N is a Cyclone® IV GX field programmable gate array (FPGA) offered in a 484-ball BGA package. It provides significant on-chip logic and embedded memory capacity, a substantial I/O count, and industry-grade operating range for embedded and industrial applications.

With 149,760 logic elements and approximately 6.64 Mbits of embedded memory, this device targets designs that require large programmable logic capacity, plentiful I/O, and operation across an extended temperature range.

Key Features

• Logic Capacity — 149,760 logic elements to implement complex programmable logic and custom processing pipelines.
• Embedded Memory — Approximately 6.64 Mbits of on-chip RAM for buffering, state storage, and data processing without heavy external memory dependence.
• I/O Count — 270 general-purpose I/O pins to support wide connectivity and parallel interfacing with external devices and subsystems.
• Package and Mounting — 484-ball BGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting style for compact board-level integration.
• Power — Core voltage supply range of 1.16 V to 1.24 V to match system power-rail planning and regulator selection.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
• Standards Compliance — RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Industrial Control — Implement motion control, sequence logic, and custom control functions that benefit from large logic capacity and extended temperature operation.
• Embedded Processing — Deploy as a configurable processing fabric where on-chip RAM and abundant logic elements reduce external component count.
• High-Density I/O Systems — Use in equipment requiring many parallel or diverse I/O interfaces, leveraging the 270 available I/O pins for sensors, actuators, and peripherals.

Unique Advantages

• High Logic Integration: 149,760 logic elements enable consolidation of multiple functions into a single FPGA, simplifying board design and lowering BOM complexity.
• Substantial On-Chip Memory: Approximately 6.64 Mbits of embedded RAM supports local buffering and fast data handling without immediate reliance on external memory.
• Robust Industrial Operation: Rated from −40 °C to 100 °C for reliable performance in industrial environments and temperature-challenging deployments.
• Generous I/O Count: 270 I/Os provide flexibility to connect many external signals and interfaces directly to the FPGA fabric.
• Compact BGA Footprint: 484-ball BGA (23×23) provides a balance of routing density and board space efficiency for high-density designs.
• Regulatory Compliance: RoHS compliance supports environmentally constrained product requirements.

Why Choose EP4CGX150CF23I7N?

The EP4CGX150CF23I7N positions itself as a high-capacity, industrial-grade Cyclone® IV GX FPGA suitable for designs that need substantial programmable logic, embedded memory, and a high count of I/Os in a compact BGA package. Its specified core voltage range and extended operating temperature make it a practical choice for embedded and industrial systems that demand predictable electrical and thermal behavior.

For teams building scalable, reliable hardware, this device offers a combination of integration and robustness that helps reduce external component needs and supports long-term deployment in industrial environments.

Request a quote or submit a pricing inquiry to evaluate EP4CGX150CF23I7N for your next design project.