EP4CGX150DF31C7

The EP4CGX150DF31C7 is a Cyclone® IV GX field programmable gate array (FPGA) offering a balanced combination of logic capacity, embedded memory and I/O resources in a commercial-grade device. Built for programmable logic integration, this surface-mount FPGA provides 149,760 logic elements, approximately 6.6 Mbits of embedded memory, and 475 I/O pins in an 896-ball BGA package.

With a nominal supply voltage window of 1.16 V to 1.24 V and an operating temperature range of 0 °C to 85 °C, this part is suitable for a wide range of commercial embedded and system-design applications that require dense logic, on-chip memory, and extensive connectivity.

Key Features

• Core Architecture: Cyclone IV GX FPGA family offering programmable logic resources suitable for complex digital designs.
• Logic Capacity: 149,760 logic elements to implement wide-ranging combinational and sequential logic functions.
• Embedded Memory: Approximately 6.6 Mbits of on-chip RAM for data buffering, FIFOs, and algorithm state storage.
• I/O Count: 475 I/O pins to support high-density external interfacing and multi-channel connectivity.
• Power Supply: Operates with a core voltage supply between 1.16 V and 1.24 V, enabling tightly controlled power designs.
• Package and Mounting: 896-ball fine-pitch BGA (31 × 31) in a surface-mount package suited for compact board layouts.
• Temperature and Grade: Commercial grade with an operating temperature range from 0 °C to 85 °C.
• Compliance: RoHS-compliant construction.

Typical Applications

• Embedded Systems: Implement custom logic and control functions where on-chip memory and substantial logic capacity are required.
• High-Density I/O Control: Drive multi-channel interfaces, parallel buses, and complex peripheral connectivity using 475 available I/O pins.
• Memory-Intensive Logic: Use the approximately 6.6 Mbits of embedded RAM for buffering, packet processing, and data-path implementations.
• Prototype and System Integration: Deploy as a programmable platform for validating designs and integrating multiple digital subsystems in a single device.

Unique Advantages

• Substantial Logic Resource: 149,760 logic elements provide headroom for complex finite-state machines, datapaths, and parallel processing blocks.
• Integrated On-Chip Memory: Approximately 6.6 Mbits of embedded RAM reduces external memory dependency and simplifies board-level routing.
• Extensive Connectivity: 475 I/O pins support dense external interfacing and reduce the need for external multiplexing or expanders.
• Compact BGA Package: The 896-ball (31 × 31) BGA enables high-density PCB layouts while maintaining a compact board footprint.
• Commercial-Grade Operation: Designed for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• RoHS Compliant: Manufactured to meet RoHS requirements for environmental compliance.

Why Choose EP4CGX150DF31C7?

The EP4CGX150DF31C7 positions itself as a capable, commercial-grade FPGA option within the Cyclone IV GX family, delivering a combination of large logic capacity, substantial embedded memory, and high I/O density in a single, surface-mount BGA package. These attributes make it appropriate for designers who need to consolidate logic, memory, and interfacing into a compact FPGA solution.

Its defined voltage supply range and commercial operating temperature make it suitable for a range of embedded and system-level designs where predictable electrical and thermal characteristics are important. The part is well suited for teams looking to implement complex digital functions while minimizing external BOM for memory and I/O expansion.

Request a quote or submit an inquiry to receive pricing and availability for the EP4CGX150DF31C7 and to discuss how this Cyclone IV GX FPGA can fit into your next design.