EP4CGX150DF31C8

The EP4CGX150DF31C8 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) IC providing a high logic-density programmable fabric in a compact BGA package. It integrates 149,760 logic elements and approximately 6.64 Mbits of on-chip RAM, together with 475 device I/Os to support complex, highly parallel logic and interfacing requirements.

Designed for surface-mount assembly in an 896-BGA (896-FBGA, 31×31) package, this commercial-grade device operates from a 1.16 V to 1.24 V core supply and is specified for 0 °C to 85 °C ambient operation.

Key Features

• Core Logic  149,760 logic elements provide a large programmable fabric for implementing complex digital functions and parallel processing tasks.
• Configurable Logic Blocks (CLBs)  9,360 CLBs (configurable logic blocks) enable structured logic partitioning and resource allocation within the FPGA.
• Embedded Memory  Approximately 6.64 Mbits of total on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Count  475 device I/Os to accommodate wide buses, multiple interfaces, and high pin-count peripheral integration.
• Package and Mounting  896-BGA (supplier package: 896-FBGA, 31×31) surface-mount package for space-efficient board designs with robust thermal and mechanical characteristics.
• Power  Core voltage supply range of 1.16 V to 1.24 V for defined power planning and regulator selection.
• Operating Temperature and Grade  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Unique Advantages

• High logic density: 149,760 logic elements enable substantial on-chip implementation of digital functions, reducing reliance on external logic.
• Significant embedded memory: Approximately 6.64 Mbits of RAM provides local storage for data buffering and state retention without additional external memory components.
• Extensive I/O availability: 475 I/Os support multiple interfaces and parallel connectivity, simplifying integration with sensors, peripherals, and external devices.
• Compact BGA package: 896-BGA (31×31) balances high pin count with a small PCB footprint for dense board layouts.
• Defined core voltage: A narrow 1.16 V–1.24 V supply range simplifies power-supply design and core power budgeting.
• Commercial temperature qualification: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.

Why Choose EP4CGX150DF31C8?

EP4CGX150DF31C8 positions itself as a high-capacity Cyclone® IV GX FPGA option when your design requires a large programmable fabric, substantial embedded memory, and broad I/O capability in a single surface-mount package. Its combination of 149,760 logic elements, approximately 6.64 Mbits of on-chip RAM, and 475 I/Os makes it suitable for designs that need dense logic integration and flexible interfacing while maintaining a commercial temperature rating.

This device is appropriate for engineers and procurement teams specifying a high-density FPGA in an 896-BGA form factor with clearly defined supply and temperature requirements. Its RoHS compliance and packaged format support standard manufacturing processes and board-level integration.

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