EP4CGX150DF31C8N

The EP4CGX150DF31C8N is a Cyclone® IV GX field programmable gate array (FPGA) IC from Intel, packaged in an 896-BGA. It provides substantial programmable logic capacity and embedded memory for mid- to high-density digital designs.

With 149,760 logic elements, approximately 6.6 Mbits of embedded memory, and up to 475 device I/O pins in a 31 × 31 896-FBGA package, this device targets applications that require large logic integration, significant on-chip RAM, and high I/O density within a commercial temperature range.

Key Features

• Logic Capacity — 149,760 logic elements provide large-scale programmable logic resources for complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 6.6 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
• I/O Density — 475 device I/O pins allow extensive peripheral and bus interfacing without external I/O expanders.
• Power — Supply voltage range of 1.16 V to 1.24 V for core operation, enabling predictable power planning for system designers.
• Package & Mounting — 896-BGA surface-mount package (supplier package: 896-FBGA, 31×31) for high pin-count integration in compact board footprints.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for standard commercial electronics environments.
• Regulatory — RoHS compliant, supporting environmental and manufacturing requirements for lead-free production.

Typical Applications

• Dense digital systems — Integration of large combinational and sequential logic where high logic element counts are required.
• High-pin-count interface consolidation — Aggregating multiple I/O channels and interfaces using the device's 475 I/O pins.
• On-chip buffering and memory functions — Implementing packet buffering, FIFOs, or other memory-backed logic using approximately 6.6 Mbits of embedded RAM.
• Prototyping and custom hardware acceleration — Rapid implementation of custom logic and acceleration blocks that leverage sizable logic resources and embedded memory.

Unique Advantages

• High integration density: 149,760 logic elements reduce the need for multiple discrete logic devices and simplify board-level design.
• Significant on-chip memory: Approximately 6.6 Mbits of embedded RAM enables local buffering and state retention without external memory.
• Extensive I/O capability: 475 I/O pins accommodate complex multi-channel interfaces and high-pin-count connectors directly on the FPGA.
• Compact, manufacturable package: 896-BGA (31×31) surface-mount package supports high-density PCB layouts while maintaining mechanical robustness.
• Predictable power envelope: Narrow core supply range (1.16 V–1.24 V) aids in power supply design and thermal planning.
• RoHS compliant: Supports lead-free manufacturing processes and environmental compliance requirements.

Why Choose EP4CGX150DF31C8N?

The EP4CGX150DF31C8N delivers a blend of large logic capacity, substantial embedded memory, and high I/O count in a single commercial-grade FPGA package. It's suited to designers who need to consolidate complex digital functions, implement memory-backed logic, and interface many external signals without adding discrete components.

Backed by Intel's Cyclone® IV GX architecture and provided in a compact 896-BGA footprint, this device supports scalable designs where integration, predictable power requirements, and RoHS compliance are important for production-ready solutions.

Request a quote today to check availability and pricing for EP4CGX150DF31C8N and to discuss how this FPGA can meet your project's logic, memory, and I/O needs.