EP4CGX150DF31I7

The EP4CGX150DF31I7 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) from Intel, delivered in an industrial-grade 896-ball BGA package. It combines a large logic capacity with substantial embedded RAM and high I/O count for dense, programmable implementations.

With 149,760 logic elements, approximately 6.64 Mbits of on-chip RAM and 475 I/Os, this device is suited to applications that require significant logic integration, on-chip memory, and broad external interfacing within a surface-mount 31×31 FBGA footprint.

Key Features

• Logic Capacity — 149,760 logic elements for implementing complex, custom digital functions and parallel datapaths.
• Embedded Memory — Approximately 6.64 Mbits of total on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Density — 475 user I/Os to enable broad peripheral connectivity and high pin-count interfaces.
• Power Supply — Supported core voltage range of 1.16 V to 1.24 V for defined power planning and regulator selection.
• Package — 896-ball FBGA (31×31) surface-mount package providing a compact, high-pin-count solution for dense PCB designs.
• Temperature and Grade — Industrial grade device with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
• Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control — Leverages industrial temperature rating (−40°C to 100°C) and high logic density to implement control algorithms, protocol bridging, and deterministic I/O processing.
• Data Acquisition & Interface — Large on-chip RAM and 475 I/Os support buffering and interfacing to multiple sensors, converters, and external devices.
• Embedded System Integration — Combines significant logic resources and memory in an 896-BGA package for compact, programmable subsystem functions in embedded platforms.
• Custom Communication Logic — High I/O count and abundant logic elements enable implementation of custom protocol engines, parallel interfaces, or protocol conversion blocks.

Unique Advantages

• Substantial Logic Capacity: 149,760 logic elements enable large-scale custom designs and complex state machines without excessive external ASIC dependency.
• On-chip Memory Resources: Approximately 6.64 Mbits of embedded RAM reduce reliance on external memory, simplifying board design and reducing BOM.
• High I/O Count: 475 I/Os provide flexibility for dense peripheral connections, multi-channel interfaces, and parallel data paths.
• Industrial Temperature Rating: Rated from −40°C to 100°C for reliable operation across a wide range of industrial environments.
• Compact High-Pin Package: 896-FBGA (31×31) surface-mount package balances high pin count with a compact board footprint for space-constrained systems.
• RoHS Compliant: Meets RoHS requirements to support modern manufacturing and environmental standards.

Why Choose EP4CGX150DF31I7?

The EP4CGX150DF31I7 positions itself as a high-capacity Cyclone® IV GX FPGA option for engineers seeking a balance of logic resources, embedded RAM, and extensive I/O in an industrial-grade device. Its combination of 149,760 logic elements, approximately 6.64 Mbits of on-chip RAM, and 475 I/Os makes it suitable for designs that require significant programmable integration within a compact 896-FBGA package.

Manufactured by Intel and RoHS compliant, this FPGA is appropriate for system designers building industrial and embedded solutions who need predictable operating conditions (1.16 V–1.24 V core range and −40°C to 100°C) and a high degree of on-chip integration to reduce external components and simplify system architecture.

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