EP4CGX150DF31I7N

The EP4CGX150DF31I7N is an Intel Cyclone® IV GX field programmable gate array (FPGA) supplied in an 896‑ball FBGA package. It provides a high-density configurable-logic resource set together with substantial on-chip memory and a large number of I/O pins, delivered in an industrial-grade, surface-mount package.

Designed for applications that require extensive programmable logic, embedded memory and broad I/O connectivity within an industrial temperature range, this device balances integration and system-level flexibility while operating from a specified core supply window.

Key Features

• Core Logic — 149,760 logic elements providing a large programmable fabric for custom logic, state machines and datapath implementations.
• Configurable Logic Blocks (CLBs) — 9,360 CLBs to structure and partition logic resources across designs.
• Embedded Memory — Approximately 6.64 Mbits of on-chip RAM for buffering, FIFOs and local storage.
• I/O Capacity — 475 user I/O pins to support extensive peripheral interfaces and board-level connectivity.
• Package — 896‑BGA (supplier package: 896‑FBGA, 31×31) for high-density board integration and compact system layouts.
• Power — Core voltage supply specified from 1.16 V to 1.24 V for predictable power planning and regulator selection.
• Thermal & Mounting — Industrial operating temperature range from −40°C to 100°C and surface-mount packaging suitable for standard SMT assembly.
• Compliance — RoHS compliant to meet common environmental directives for electronic assemblies.

Typical Applications

• Industrial Control — Implement complex custom control logic and real-time processing in industrial equipment using the device’s high logic density and industrial temperature rating.
• Communications Equipment — Deploy protocol engines, packet handling and interface bridging where large logic capacity and numerous I/Os are required.
• Imaging and Signal Processing — Support parallel datapath implementations and local buffering with abundant logic elements and approximately 6.64 Mbits of embedded RAM.
• Prototyping and System Integration — Integrate large custom functions and multiple I/O domains in a single FPGA for proof-of-concept systems and integration platforms.

Unique Advantages

• High logic capacity: 149,760 logic elements enable substantial on-chip functionality that can reduce external glue logic and simplify board design.
• Significant embedded memory: Approximately 6.64 Mbits of on-chip RAM supports local buffering and accelerates data-path implementations.
• Extensive I/O: 475 I/O pins provide flexibility for multi-interface designs and dense peripheral connectivity.
• Industrial temperature range: Rated from −40°C to 100°C for deployment in temperature-challenging environments.
• Compact, high-density package: 896‑FBGA (31×31) delivers a small footprint for space-constrained system designs while accommodating many signals.
• RoHS compliant: Meets common environmental requirements for modern electronic assemblies.

Why Choose EP4CGX150DF31I7N?

The EP4CGX150DF31I7N combines a large programmable fabric, meaningful embedded memory and broad I/O capacity in an industrial-grade FPGA package, making it well suited to designs that demand significant on-chip resources and reliable operation across a wide temperature range. Its specified core voltage window and surface-mount 896‑BGA footprint support practical power and board-level integration choices.

This device is appropriate for engineering teams building industrial control systems, communications hardware, imaging pipelines or complex integration platforms that benefit from consolidating functions into a single, reprogrammable device while maintaining predictable electrical and thermal parameters.

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