EP4CGX110CF23I7N

The EP4CGX110CF23I7N is a Cyclone® IV GX field programmable gate array (FPGA) in a 484-ball BGA package designed for industrial applications. It provides large-scale reconfigurable logic, significant on-chip memory, and a high I/O count for dense, flexible system designs.

Built for surface-mount assembly and rated for industrial temperature operation, this device is suited to applications that require substantial logic capacity and embedded memory within a compact package footprint.

Key Features

• Logic Capacity: 109,424 logic elements to implement complex, large-scale digital designs.
• Embedded Memory: Approximately 5.62 Mbits of on-chip RAM for buffering, data storage, and fast local memory operations.
• I/O Resources: 270 I/O pins to support dense interfacing and mixed-signal front-ends.
• Package and Mounting: 484-BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact PCB integration.
• Power Supply: Core voltage range of 1.16 V to 1.24 V for predictable supply planning and power budgeting.
• Operating Temperature: Industrial temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Compliance: RoHS compliant to meet common environmental directives for electronic assemblies.

Typical Applications

• Industrial Control: Implement custom control logic, communication bridges, and deterministic I/O handling for factory and automation equipment.
• Embedded Systems: Provide programmable hardware acceleration and glue logic in compact embedded platforms.
• Communications and Networking: Support protocol handling and packet processing with high logic density and abundant I/O.

Unique Advantages

• High Logic Density: 109,424 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board space.
• Substantial On-Chip Memory: Approximately 5.62 Mbits of RAM supports local buffering and state storage, improving data throughput and latency.
• Robust I/O Count: 270 I/O pins accommodate complex interfaces and multiple peripheral connections without external multiplexing.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, supporting designs that require extended temperature tolerance.
• Compact BGA Package: 484-FBGA (23×23) delivers a high pin count in a space-efficient footprint suitable for dense PCB layouts.
• Regulatory Compliance: RoHS compliance simplifies environmental qualification for manufactured products.

Why Choose EP4CGX110CF23I7N?

The EP4CGX110CF23I7N combines significant logic capacity, sizable embedded memory, and a high I/O count in a compact 484-BGA package, making it a practical choice for engineers designing industrial and embedded systems that require reconfigurable hardware. Its defined core voltage range and industrial temperature rating provide clear design parameters for power and thermal planning.

This device is suitable for teams seeking a high-density FPGA solution to consolidate functions, reduce external components, and maintain deterministic, application-specific hardware behavior while adhering to RoHS requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the EP4CGX110CF23I7N.