EP4CGX110CF23C8N

The EP4CGX110CF23C8N is an Intel Cyclone IV GX family FPGA supplied in a 484-BGA package for surface-mount assembly. It delivers a high logic capacity alongside multi-megabit on-chip memory and a large I/O count, making it suited for designs that require dense programmable logic, embedded memory, and extensive external interfacing.

Key Features

• Logic Capacity  Approximately 109,424 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 5.62 Mbits of on-chip RAM to support buffering, FIFOs, and local storage requirements.
• I/O Count  270 user I/O pins to support multiple interfaces and external peripherals.
• Power Supply  Nominal core voltage range of 1.16 V to 1.24 V to match system power-rail requirements.
• Package & Mounting  484-BGA (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for compact board integration.
• Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Compliance  RoHS-compliant construction for environmental and regulatory considerations.

Typical Applications

• Embedded systems  High-logic-count designs that require substantial on-chip RAM and flexible I/O for custom control and signal processing functions.
• Communications and networking  I/O-rich implementations where dense programmable logic and embedded memory are used for protocol processing and packet handling.
• Hardware acceleration  Custom compute blocks and data-path implementations that benefit from significant logic resources and multi-megabit embedded memory.

Unique Advantages

• High logic density: The device’s approximately 109,424 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 5.62 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Generous I/O availability: 270 I/O pins support multiple external interfaces and simplify board-level connectivity.
• Compact BGA packaging: The 484-BGA (23×23) package provides a space-efficient solution for high-density PCB layouts.
• Commercial temperature grade: Specified 0 °C to 85 °C operating range for standard commercial applications.
• RoHS compliant: Environmentally compliant manufacturing for easier regulatory alignment.

Why Choose EP4CGX110CF23C8N?

The EP4CGX110CF23C8N combines high logic capacity, multi-megabit on-chip memory, and a large number of I/O in a compact 484-BGA surface-mount package. It is positioned for engineers and procurement teams building commercial-grade systems that need dense programmable logic, embedded RAM, and flexible external interfacing within standard temperature ranges.

For designs that require scalable logic resources and integrated memory without stepping up to larger or more specialized device classes, this Cyclone IV GX device offers a balanced mix of capacity, connectivity, and manufacturability.

Request a quote or submit your requirements to get pricing and availability for the EP4CGX110CF23C8N.