EP4CGX110CF23C7

The EP4CGX110CF23C7 is a Cyclone® IV GX field-programmable gate array (FPGA) in a 484‑ball BGA package designed for board-level integration. It delivers high logic density with substantial on-chip memory and a large I/O count to support complex, configurable digital designs.

This commercial‑grade, surface‑mount device operates from a core supply range of 1.16 V to 1.24 V and is specified for 0 °C to 85 °C, providing a balance of performance and practicality for mainstream embedded and logic‑intensive applications.

Key Features

• High logic capacity — 109,424 logic elements to implement complex, parallelizable digital functions and custom hardware accelerators.
• Embedded memory — Approximately 5.62 Mbits of on‑chip RAM for buffering, lookup tables, and data storage within user logic.
• Generous I/O — 270 general‑purpose I/O pins to interface with multiple peripherals, buses, and external devices.
• Package and mounting — 484‑FBGA (23×23) package in a surface‑mount form factor for compact PCB integration and high connector density.
• Power supply — Core voltage range of 1.16 V to 1.24 V to match system power rails and enable predictable power budgeting.
• Temperature and grade — Commercial operating range of 0 °C to 85 °C suitable for standard commercial environments.
• Environmental compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Logic‑intensive processing — Implement custom datapaths and parallel processing functions using the device’s large logic element count and embedded memory.
• Multi‑interface bridging — Use the abundant I/O to connect and bridge multiple digital interfaces and peripheral buses on a single board.
• Embedded system integration — Integrate configurable control and signal‑processing blocks where on‑chip memory and flexible I/O mappings are required.

Unique Advantages

• High integration density: 109,424 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components.
• Substantial on‑chip memory: Approximately 5.62 Mbits of embedded RAM supports buffering and state storage without additional external memory.
• Flexible system I/O: 270 I/Os provide extensive connectivity options for complex system topologies and mixed‑signal interfaces.
• Compact board footprint: 484‑FBGA (23×23) surface‑mount package allows high routing density and compact PCB layouts.
• Predictable power envelope: Narrow core voltage range (1.16 V–1.24 V) simplifies power supply design and thermal planning.
• RoHS compliant: Meets common environmental manufacturing requirements for modern electronics production.

Why Choose EP4CGX110CF23C7?

The EP4CGX110CF23C7 combines a high logic element count, significant embedded memory, and extensive I/O in a compact 484‑FBGA package, making it suitable for designers who need to implement complex, configurable digital systems on a single device. Its commercial grade and RoHS compliance align it with mainstream product lines where reliable, scalable FPGA integration is required.

This part is a strong fit for teams designing high‑density logic solutions, multi‑interface controllers, and embedded systems that benefit from on‑chip memory and a high I/O count while maintaining a compact board footprint and predictable power requirements.

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