EP4CGX110CF23C8

The EP4CGX110CF23C8 is a Cyclone® IV GX Field Programmable Gate Array (FPGA) offered in a 484‑ball BGA package. It provides a high count of programmable logic resources, embedded memory, and a substantial I/O complement suitable for mid-density digital designs.

This device targets applications that require a balance of logic capacity, on‑chip RAM, and flexible I/O in a surface‑mount package, all within commercial temperature and supply ranges.

Key Features

• Core Logic — 109,424 logic elements provide a large pool of programmable resources for implementing custom digital logic and state machines.
• Configurable Logic Blocks (CLBs) — 6,839 CLBs enable structured allocation of logic for partitioned designs and hierarchical implementations.
• Embedded Memory — Approximately 5.62 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑mapped logic structures.
• I/O Density — 270 user I/O pins to support multiple peripheral interfaces and parallel connections in complex system designs.
• Power and Supply — Device core operating supply range from 1.16 V to 1.24 V to match targeted system power rails.
• Package and Mounting — 484‑BGA (484‑FBGA, 23×23) in a surface‑mount format for compact board layouts and reliable solder interconnects.
• Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial deployments.

Typical Applications

• Embedded system control — Implement custom control logic, glue logic, and finite state machines using available logic elements and on‑chip RAM.
• High‑density I/O tasks — Support multiple parallel and serialized interfaces with 270 I/O pins for connectivity and board-level integration.
• Data buffering and preprocessing — Use approximately 5.62 Mbits of embedded memory for packet buffering, FIFOs, and pre‑processing of streaming data.

Unique Advantages

• Large logic fabric: 109,424 logic elements enable complex digital designs while keeping integration on a single device.
• Substantial embedded memory: Approximately 5.62 Mbits of RAM reduces dependency on external memory for many buffering and temporary storage needs.
• High I/O count: 270 user I/Os simplify system integration by accommodating multiple interfaces without external multiplexing.
• Compact surface‑mount package: 484‑BGA (23×23) allows for a dense PCB footprint and reliable mechanical mounting in space‑constrained designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial applications and environments.
• RoHS compliant: Aligns with standard lead‑free manufacturing and environmental requirements for commercial products.

Why Choose EP4CGX110CF23C8?

The EP4CGX110CF23C8 combines a substantial logic resource pool with multiple megabits of embedded RAM and a high I/O count in a single, surface‑mount 484‑BGA package. Its specified core supply range and commercial temperature rating make it suitable for a broad range of mainstream embedded and digital designs that require on‑device capacity without external logic proliferation.

This device is well suited for designers looking to consolidate functions, reduce BOM complexity, and implement mid‑to‑high complexity logic and buffering tasks within a single FPGA footprint.

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