EP4CE75F29I7

The EP4CE75F29I7 is an Intel Cyclone® IV E field programmable gate array (FPGA) supplied in a 780-ball FBG A package. It delivers a balance of programmable logic, on-chip memory, and I/O connectivity in a surface-mount BGA footprint targeted at industrial-grade applications.

This device provides a large pool of logic elements and embedded RAM with a broad I/O count, combined with an extended operating temperature range and a 1.15 V to 1.25 V core supply window, enabling designs that require substantial integration and reliable operation across -40 °C to 100 °C.

Key Features

• Logic Capacity — 75,408 logic elements and 4,713 logic blocks give designers significant programmable resources for complex digital implementations.
• On‑Chip Memory — Approximately 2.81 Mbits of embedded memory (2,810,880 total RAM bits) for buffering, state storage, and data-path acceleration.
• I/O and Package — 426 user I/O pins in a 780-ball FBGA (29 × 29) package, optimized for dense board-level integration with surface-mount assembly.
• Power and Supply — Designed for a core voltage supply range of 1.15 V to 1.25 V to match system power-rail planning and device requirements.
• Industrial Temperature Range — Qualified to operate from -40 °C to 100 °C for deployments that demand extended thermal tolerance.
• Mounting and Compliance — Surface-mount 780-BGA package and RoHS compliance for contemporary manufacturing and environmental requirements.

Unique Advantages

• Substantial Logic Resources: 75,408 logic elements enable integration of complex state machines, custom accelerators, and glue logic on a single device, reducing external components.
• Generous Embedded Memory: Approximately 2.81 Mbits of on-chip RAM supports local buffering and high-throughput data paths without immediate reliance on external memory.
• High I/O Count: 426 I/O pins provide flexible interfacing for multi-channel systems, sensor arrays, and dense communication interfaces.
• Industrial-Grade Thermal Range: Rated from -40 °C to 100 °C to support designs intended for demanding environmental conditions.
• Compact BGA Integration: 780-FBGA (29 × 29) packaging provides a compact footprint for space-constrained PCBs while maintaining extensive I/O and signal routing options.
• Regulatory Compliance: RoHS-compliant construction simplifies environmental compliance in global production.

Why Choose EP4CE75F29I7?

The EP4CE75F29I7 positions itself as a robust, industrial‑rated Cyclone IV E FPGA option for projects that require significant programmable logic, embedded memory, and a large number of I/Os in a compact BGA package. Its specified core supply range and extended operating temperature make it suitable for designs where tight power planning and thermal resilience are key considerations.

This device is a fit for engineering teams seeking to consolidate functions into a single FPGA—reducing board-level BOM and simplifying system integration—while relying on Intel’s Cyclone IV device lineage and available technical documentation for design and system planning.

Request a quote or submit an inquiry to receive pricing and availability for the EP4CE75F29I7 and to discuss how it can fit into your next design.