EP4CE75F29C8L

The EP4CE75F29C8L is a Cyclone® IV field programmable gate array (FPGA) IC from Intel, provided in a 780-ball fine-pitch BGA (29×29) surface-mount package. It delivers a high logic-density FPGA fabric targeted for commercial embedded and digital logic applications that require substantial on-chip resources, flexible I/O, and low-voltage core operation.

With 75,408 logic elements, approximately 2.81 Mbits of embedded memory and 426 user I/O pins, this device is engineered to consolidate custom logic, I/O interfacing, and on-chip memory in a single programmable device while operating within a commercial temperature range.

Key Features

• Core Logic  Contains 75,408 logic elements to implement complex custom logic functions and state machines.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM for buffer storage, FIFOs, and state data without external memory.
• I/O Capacity  426 user I/O pins provide broad interfacing flexibility for parallel buses, peripherals, and board-level signal routing.
• Package & Mounting  780-FBGA (29×29) package in a 780-ball BGA format, intended for surface-mount assembly to support compact board designs.
• Power Supply  Core voltage specification range of 0.97 V to 1.03 V for low-voltage silicon operation.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C for general-purpose commercial applications.
• Regulatory  RoHS-compliant construction to meet standard environmental requirements.
• Documentation Coverage  Vendor device handbook and datasheet coverage includes operating conditions, absolute maximum ratings, DC characteristics, power and supply current data, switching characteristics, and I/O specifications for detailed design reference.

Typical Applications

• Commercial Embedded Systems  Programmable control logic and custom peripherals for commercial devices that require dense logic and on-chip memory.
• I/O-Intensive Interfaces  Board-level bridging and protocol adaptation leveraging 426 user I/Os for parallel and multiplexed connections.
• Data Buffering and Packet Processing  Use of embedded RAM (approximately 2.81 Mbits) to implement buffers, FIFOs, and temporary storage for data-path logic.
• Prototyping and System Integration  Platform for evaluating and integrating custom digital functions in commercial product development within a 0 °C–85 °C operating window.

Unique Advantages

• High Logic Density:  75,408 logic elements enable implementation of sizeable custom logic blocks and complex state machines on a single device, reducing external component count.
• Substantial On-Chip Memory:  Approximately 2.81 Mbits of embedded RAM simplifies designs that require moderate buffering or temporary storage without adding external memory.
• Extensive I/O Resources:  426 user I/Os afford flexible connectivity for multiple peripherals or bus interfaces directly from the FPGA.
• Compact BGA Footprint:  780-FBGA (29×29) package supports dense board layouts and surface-mount assembly for space-constrained designs.
• Low-Voltage Core Operation:  Core supply range of 0.97 V–1.03 V supports low-voltage system architectures and power budgeting.
• Commercial-Grade and RoHS Compliant:  Designed for commercial applications with RoHS compliance for regulatory alignment.

Why Choose EP4CE75F29C8L?

The EP4CE75F29C8L positions itself as a high-density Cyclone IV FPGA option for commercial embedded designs that need a balance of logic capacity, on-chip memory, and extensive I/O in a compact BGA package. Its documented operating conditions, DC characteristics, and switching information provide the technical detail needed for integration into production hardware.

This device is well suited for design teams seeking to consolidate discrete logic and buffering functions into a single programmable device, reduce BOM complexity, and leverage comprehensive datasheet/hardware handbook coverage during development and validation.

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