EP4CE75F29C7N

The EP4CE75F29C7N is a Cyclone® IV E field programmable gate array (FPGA) IC from Intel, delivered in a 780-ball fine-pitch BGA package. It combines high-density programmable logic with on-chip RAM and a broad complement of I/O for commercial-grade applications.

With 75,408 logic elements, approximately 2.81 Mbits of embedded RAM and 426 user I/Os, this device targets commercial embedded systems and designs that require substantial logic capacity, integrated memory, and extensive interfacing in a surface-mount BGA footprint.

Key Features

• Core and Architecture  Cyclone IV E FPGA family device delivering 75,408 logic elements for complex programmable logic implementations.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM (total RAM bits: 2,810,880) to support buffering, FIFOs, and data storage without immediate dependence on external memory.
• I/O Resources  Up to 426 I/Os to accommodate wide peripheral interfacing, bus connections, and multi-channel signal handling; I/O standards and switching characteristics are documented in the Cyclone IV device handbook.
• Power Supply  Core voltage supply specified at 1.15 V to 1.25 V, enabling predictable power planning for designs targeting this device.
• Package and Mounting  780-FBGA (29×29) package; surface-mount mounting for compact, high-density PCB integration.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support regulatory requirements for commercial electronics manufacturing.

Typical Applications

• Commercial Embedded Systems  Programmable control, data processing and I/O aggregation using the device’s logic capacity and 426 I/Os.
• Communications and Protocol Handling  On-chip RAM and dense logic resources enable packet buffering, protocol state machines, and interface bridging in networking equipment.
• Prototyping and Development  High logic element count and extensive I/O make the device suitable for evaluation boards and functional prototyping of FPGA-based designs.

Unique Advantages

• High Logic Capacity: 75,408 logic elements provide headroom for complex finite-state machines, datapaths, and custom logic blocks.
• Substantial On-Chip Memory: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O Count: 426 I/Os simplify integration with sensors, peripherals, and host interfaces without extensive board-level multiplexing.
• Compact BGA Footprint: 780-FBGA (29×29) provides a high-density package for space-constrained PCB layouts while supporting surface-mount assembly.
• Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS Compliant: Supports environmental manufacturing requirements for commercial electronic products.

Why Choose EP4CE75F29C7N?

The EP4CE75F29C7N positions itself as a high-density, commercially graded Cyclone IV E FPGA optimized for designs that need significant programmable logic, embedded memory, and a large number of I/Os in a compact BGA package. Its specification set supports a wide range of commercial embedded systems where on-chip resources can reduce board-level complexity.

Engineers selecting this device benefit from defined operating and supply parameters (core voltage 1.15–1.25 V, operating temperature 0 °C–85 °C) and documentation provided in the Cyclone IV Device Handbook and device datasheet for detailed electrical and timing specifications.

If you would like pricing, lead-time, or configuration information for EP4CE75F29C7N, request a quote or submit an inquiry and we will respond with the next steps to support your design and procurement process.