EP4CE75F29C6

The EP4CE75F29C6 is a Cyclone® IV E field programmable gate array (FPGA) in a 780-ball BGA package, designed for commercial-grade embedded designs. It provides a high logic-capacity fabric with substantial on-chip memory and a large I/O count, and is intended for systems requiring a surface-mount, RoHS-compliant programmable logic device.

Key Features

• Core Logic 75,408 logic elements provide the programmable logic resources needed for complex combinational and sequential logic implementation.
• Embedded Memory Approximately 2.81 Mbits of on-chip RAM (2,810,880 bits) for data buffering, lookup tables, and state storage.
• I/O Resources 426 I/O pins to support wide parallel interfaces, bus connectivity, and multiple peripheral signals.
• Power Operates from a core supply range of 1.15 V to 1.25 V, enabling designs targeting low-voltage FPGA operation.
• Package & Mounting Supplied in a 780-FBGA (29×29) / 780-BGA package and intended for surface-mount PCB assembly to support compact board layouts.
• Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Compliance RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

• Commercial embedded systems — Use the EP4CE75F29C6 where commercial-grade programmable logic is required to implement custom control and interfacing functions.
• High-density I/O designs — 426 I/O pins enable wide external connectivity for parallel buses, sensor arrays, and peripheral interfaces.
• Memory-intensive logic — Approximately 2.81 Mbits of embedded memory supports buffering, LUT-based processing, and state storage within the FPGA fabric.
• Compact board-level integration — The 780-FBGA (29×29) package and surface-mount mounting simplify integration into compact PCBs.

Unique Advantages

• High logic capacity: 75,408 logic elements support substantial programmable logic requirements without external logic expansion.
• Significant on-chip RAM: Approximately 2.81 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage tasks.
• Extensive I/O availability: 426 I/O pins provide flexibility for parallel interfaces and multiple peripheral connections.
• Compact, surface-mount BGA: 780-FBGA (29×29) packaging enables dense board layouts while maintaining high pin counts.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial system environments.
• RoHS compliant: Environmentally conscious manufacturing and supply chain compatibility.

Why Choose EP4CE75F29C6?

The EP4CE75F29C6 Cyclone® IV E FPGA combines a large logic element count, substantial embedded memory, and a high I/O pin count in a compact 780-FBGA package, making it well-suited for commercial embedded designs that require on-chip resources and dense board-level integration. Its low-voltage core range and RoHS compliance help align designs with contemporary power and environmental requirements.

Engineers and procurement teams looking for a commercially graded, high-capacity FPGA from a recognized manufacturer can leverage EP4CE75F29C6 for scalable logic implementations and efficient system integration.

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