EP4CE75F23I7N

The EP4CE75F23I7N is a Cyclone® IV field programmable gate array (FPGA) in a 484-ball BGA package. It provides a substantial resource set including 75,408 logic elements, approximately 2.81 Mbits of embedded memory, and 292 user I/Os for complex custom logic and system integration.

Designed and specified for industrial-grade operation, this device combines a high logic capacity with broad I/O count and a compact 484-FBGA (23×23) surface-mount package. Detailed device documentation covers operating conditions, DC characteristics, power, and switching specifications to support engineering evaluation and deployment.

Key Features

• Cyclone IV FPGA architecture  A Cyclone® IV class FPGA offering programmable logic for custom digital designs as defined in the device handbook.
• Logic resources  75,408 logic elements to implement substantial custom logic, state machines, and glue-logic functions.
• Embedded memory  Approximately 2.81 Mbits of on-chip RAM to support buffers, lookup tables, and local data storage.
• I/O capacity  292 available I/Os to interface with sensors, peripherals, memories, and external logic.
• Package and mounting  484-BGA (484-FBGA, 23×23) surface-mount package for compact board integration.
• Core voltage  Specified voltage supply range of 1.15 V to 1.25 V for core power.
• Industrial operating range  Rated operating temperature from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory compliance  RoHS compliant.
• Comprehensive documentation  Device handbook and datasheet content detail operating conditions, absolute maximums, DC characteristics, power consumption, and switching characteristics for design validation.

Typical Applications

• Industrial control and automation  Leverage the industrial-grade temperature range and extensive logic and I/O resources for custom control logic, sensor aggregation, and protocol bridging.
• Communications and networking  Use the device’s programmable logic and I/O capacity for protocol implementation, data buffering, and interface bridging in communication systems.
• Embedded system prototyping  Deploy the FPGA as a development platform for custom IP, system integration, and proof-of-concept designs requiring flexible on-chip logic and memory.

Unique Advantages

• Large logic capacity: 75,408 logic elements provide headroom for complex finite-state machines, custom datapaths, and peripheral integration without immediate need for larger devices.
• On-chip memory for local buffering: Approximately 2.81 Mbits of embedded RAM reduces dependence on external memory for many applications, simplifying board design.
• High I/O count: 292 I/Os enable direct interfacing to numerous sensors, peripherals, and external components, minimizing additional interface ICs.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions typical of industrial systems.
• Compact BGA footprint: 484-FBGA (23×23) surface-mount package balances pin count and board area for medium-density system implementations.
• Documented electrical and timing data: Extensive device handbook and datasheet entries provide the technical detail engineers need for reliable integration and validation.

Why Choose EP4CE75F23I7N?

The EP4CE75F23I7N positions itself as a resource-rich Cyclone IV FPGA for industrial designs that require significant programmable logic, on-chip memory, and broad I/O in a compact BGA package. Its specified core voltage range and documented electrical characteristics help engineers design predictable power and timing margins.

This device is appropriate for teams building industrial control, communications interfaces, and embedded prototypes that demand scalability, clear device documentation, and a balance of logic, memory, and I/O resources. The combination of industrial temperature rating and RoHS compliance supports long-term deployment considerations.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for the EP4CE75F23I7N.