EP4CE75F23C8N

The EP4CE75F23C8N is an Intel Cyclone® IV E Field Programmable Gate Array (FPGA) IC that delivers high logic density and on-chip memory in a compact BGA package. It is a commercial‑grade FPGA configured for surface‑mount assembly and RoHS compliance.

Key device characteristics include 75,408 logic elements, approximately 2.81 Mbits of embedded memory, 292 I/O pins, and a recommended core supply range of 1.15 V to 1.25 V. The device is supplied in a 484‑FBGA (23×23) package and is specified for 0 °C to 85 °C operation.

Key Features

• Core Logic 75,408 logic elements for implementing custom digital logic and complex combinational/sequential functions.
• Logic Array Blocks (LABs) 4,713 LABs (as listed) to organize and partition logic resources for modular design.
• Embedded Memory Approximately 2.81 Mbits of on‑chip RAM for buffering, state storage, and memory‑centric logic.
• I/O Density 292 I/O pins to support multiple parallel interfaces and high‑pin‑count designs.
• Power Supply Core voltage supply range of 1.15 V to 1.25 V to match system power rails and design requirements.
• Package & Mounting Surface‑mount 484‑BGA package (supplier device package: 484‑FBGA, 23×23) for compact board integration.
• Operating Range & Grade Commercial grade with operating temperature from 0 °C to 85 °C for general embedded applications.
• Environmental Compliance RoHS compliant, meeting common lead‑free manufacturing requirements.
• Manufacturer Intel (Cyclone® IV E family) — documented device handbook and datasheet are available from the manufacturer.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate complex logic functions and prototypes using the device's large pool of logic elements and LABs.
• Memory‑assisted data handling — Use the approximately 2.81 Mbits of embedded RAM for buffering, small FIFO structures, and temporary storage within logic pipelines.
• High‑pin‑count I/O control — Leverage 292 I/O pins to interface with parallel buses, multiple peripherals, or multi‑lane I/O topologies.

Unique Advantages

• High integration density: 75,408 logic elements and 4,713 LABs enable consolidation of complex functions on a single device, reducing external component count.
• On‑chip memory resources: Approximately 2.81 Mbits of embedded RAM support data buffering and reduce reliance on external memory for many designs.
• Flexible I/O capacity: 292 I/O pins provide the capacity to connect multiple interfaces and sensors without requiring expansion hardware.
• Compact board footprint: 484‑FBGA (23×23) packaging supports high‑density board layouts while maintaining surface‑mount assembly compatibility.
• Commercial‑grade specification: Specified for 0 °C to 85 °C operation and RoHS compliance for standard embedded product deployments.

Why Choose EP4CE75F23C8N?

The EP4CE75F23C8N positions itself as a commercially graded, high‑density Cyclone® IV E FPGA suitable for designs that require substantial logic resources, meaningful on‑chip RAM, and substantial I/O capability in a compact BGA footprint. Its documented supply range and operating temperature make it appropriate for general embedded and digital designs that benefit from programmable logic integration.

Engineers and procurement teams seeking a well‑specified FPGA from Intel’s Cyclone® IV E family will find the EP4CE75F23C8N offers a balance of logic capacity, embedded memory, and I/O in a RoHS compliant, surface‑mount package—facilitating scalable designs and streamlined board integration.

Request a quote or submit an inquiry for pricing and availability of the EP4CE75F23C8N to evaluate its fit for your next programmable logic design.