EP4CE75F23I7

The EP4CE75F23I7 is an Intel Cyclone IV family FPGA supplied in a 484-ball FBGA package. It provides a high-density programmable logic fabric with industrial-grade operating range and a broad I/O complement for embedded and industrial applications.

Device characteristics and operating limits are documented in the Cyclone IV Device Handbook (Volume 3). The part combines 75,408 logic elements, substantial on-chip memory, and a compact 484-FBGA (23 × 23 mm) package to support complex, space-constrained designs.

Key Features

• Logic Capacity  Provides 75,408 logic elements for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 2.81 Mbits of on-chip RAM to support data buffering, FIFOs, and on-chip storage.
• I/O Count  292 user I/O pins to interface with sensors, peripherals, and external devices.
• Package  484-ball BGA in a 23 × 23 mm FBGA footprint for a dense, surface-mount implementation.
• Power and Core Voltage  Core supply voltage specified between 1.15 V and 1.25 V to match system power domains.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Mounting and Compliance  Surface-mount device with RoHS compliance for modern assembly and environmental requirements.
• Documented Specifications  Detailed electrical, switching, and performance specifications are available in the Cyclone IV Device Handbook (Volume 3).

Typical Applications

• Industrial Control  Industrial-grade temperature range and a large I/O count suit programmable control, motor interfaces, and factory automation logic.
• Embedded Systems  High logic density and on-chip RAM allow integration of custom processing, protocol bridges, and glue logic in compact designs.
• Prototyping and Custom Logic  The Cyclone IV programmable fabric supports iterative hardware development and deployment of tailored digital functions.

Unique Advantages

• High logic density: 75,408 logic elements enable implementation of complex logic functions and parallel processing structures on a single device.
• Significant on-chip memory: Approximately 2.81 Mbits of embedded RAM reduces external memory dependency and simplifies board-level design.
• Extensive I/O resources: 292 I/Os provide the connectivity needed for multi-device interfaces and rich peripheral integration.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact BGA package: 484-FBGA (23 × 23 mm) offers a space-efficient footprint for high-density boards.
• Standards-aligned supply: Core voltage range of 1.15 V to 1.25 V facilitates integration with common power architectures.

Why Choose EP4CE75F23I7?

The EP4CE75F23I7 positions itself as an industrial-grade, mid-to-high density FPGA choice within the Cyclone IV family, combining substantial logic capacity, embedded memory, and a large I/O count in a compact 484-FBGA package. Its documented operating characteristics in the Cyclone IV Device Handbook provide the electrical and system-level guidance needed for robust implementation.

This device is suitable for engineers and designers who require flexible, programmable logic with industrial temperature tolerance, significant on-chip resources, and a dense package for space-constrained boards. RoHS compliance and thorough device documentation support long-term product development and deployment.

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