EP4CE75F23C7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 292 2810880 75408 484-BGA |
|---|---|
| Quantity | 588 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 292 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4713 | Number of Logic Elements/Cells | 75408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2810880 |
Overview of EP4CE75F23C7N – Cyclone IV E FPGA, 484-BGA
The EP4CE75F23C7N is a Cyclone® IV E Field Programmable Gate Array (FPGA) from Intel, delivered in a 484-ball fine-pitch BGA (484-FBGA, 23×23) surface-mount package. It integrates substantial programmable logic, embedded memory, and a broad I/O count to support complex digital designs in commercial applications.
This device provides 75,408 logic elements, approximately 2.81 Mbits of embedded memory, and 292 user I/Os, while operating from a 1.15 V to 1.25 V core supply and an ambient temperature range of 0 °C to 85 °C. It is RoHS compliant and specified for commercial-grade deployments.
Key Features
- Logic Capacity 75,408 logic elements for implementing custom digital functions, state machines, and glue logic within a single FPGA package.
- Embedded Memory Approximately 2.81 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
- I/O Resources 292 user I/Os to interface with a wide range of peripherals, sensors, and external devices.
- Power and Core Voltage Designed for a low-voltage core operating range of 1.15 V to 1.25 V, allowing integration with modern low-voltage system rails.
- Package and Mounting 484-FBGA (23×23) surface-mount package provides a compact footprint with high-pin-count routing for dense system designs.
- Commercial Temperature Grade Specified for operation from 0 °C to 85 °C, matching standard commercial-environment requirements.
- Regulatory Compliance RoHS compliant for lead-free manufacturing and global electronics assembly compatibility.
- Documentation and Family Resources Supported by Cyclone IV device documentation and datasheet material for design guidance and electrical specifications.
Unique Advantages
- High logic density: 75,408 logic elements enable implementation of complex custom logic without multiple devices, reducing board space and system complexity.
- On-chip memory capacity: Approximately 2.81 Mbits of embedded RAM reduces reliance on external memory for many buffering and temporary storage needs.
- Extensive I/O: 292 user I/Os provide flexible connectivity options for parallel interfaces, control signals, and sensor/actuator networks.
- Compact, high-pin-count package: The 484-FBGA (23×23) package balances high I/O count with a compact footprint suitable for dense system layouts.
- Commercial-grade and RoHS compliant: Meets standard commercial temperature requirements and lead-free assembly constraints for mainstream product lines.
- Intel Cyclone IV E lineage: Part of the Cyclone IV family with available device handbook and datasheet reference material to support development and qualification.
Why Choose EP4CE75F23C7N?
The EP4CE75F23C7N positions itself as a capable, commercial-grade Cyclone IV E FPGA offering a strong balance of logic capacity, on-chip memory, and I/O count in a compact 484-FBGA package. Its specification set — including a low-voltage core range (1.15 V–1.25 V), approximately 2.81 Mbits of embedded RAM, 75,408 logic elements, and 292 I/Os — makes it suitable for designs that require integrated programmable logic and substantial local memory without expanding board real estate.
As a member of Intel's Cyclone IV E family, this device is supported by device handbook and datasheet documentation, helping engineering teams accelerate implementation and validation for commercial applications where RoHS compliance and standard operating temperature ranges are required.
Request a quote or submit a procurement inquiry to evaluate EP4CE75F23C7N for your next design and receive pricing and availability details.

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